1. 21 Mar, 2020 8 commits
  2. 20 Mar, 2020 1 commit
    • Greg Kroah-Hartman's avatar
      Merge tag 'icc-5.7-rc1' of https://git.linaro.org/people/georgi.djakov/linux into char-misc-next · c23ff2aa
      Greg Kroah-Hartman authored
      Georgi writes:
      
      interconnect changes for 5.7
      
      Here is a pull request with interconnect changes for the 5.7-rc1 merge
      window. It contains just driver updates, and these are:
      
      - Refactoring of the SDM845 driver, which is now improved to better
      represent the hardware.
      - New driver for SC7180 platforms.
      - New driver for OSM L3 interconnect hardware found on SDM845/SC7180
      platforms.
      Signed-off-by: default avatarGeorgi Djakov <georgi.djakov@linaro.org>
      
      * tag 'icc-5.7-rc1' of https://git.linaro.org/people/georgi.djakov/linux:
        interconnect: qcom: Add OSM L3 support on SC7180
        dt-bindings: interconnect: Add OSM L3 DT binding on SC7180
        interconnect: qcom: Add OSM L3 interconnect provider support
        dt-bindings: interconnect: Add OSM L3 DT bindings
        interconnect: qcom: Allow icc node to be used across icc providers
        interconnect: qcom: Add SC7180 interconnect provider driver
        dt-bindings: interconnect: Add Qualcomm SC7180 DT bindings
        interconnect: qcom: sdm845: Split qnodes into their respective NoCs
        interconnect: qcom: Consolidate interconnect RPMh support
        dt-bindings: interconnect: Update Qualcomm SDM845 DT bindings
        dt-bindings: interconnect: Add YAML schemas for QCOM bcm-voter
        dt-bindings: interconnect: Convert qcom,sdm845 to DT schema
      c23ff2aa
  3. 19 Mar, 2020 31 commits