hwmon/coretemp: Support multi-die/package

Package temperature sensors are actually implemented in hardware per-die.

Update coretemp to be "die-aware", so it can expose mulitple sensors per
package, instead of just one.  No change to single-die/package systems.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Ingo Molnar <mingo@kernel.org>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org>
Cc: linux-pm@vger.kernel.org
Cc: linux-hwmon@vger.kernel.org
Link: https://lkml.kernel.org/r/ec2868f35113a01ff72d9041e0b97fc6a1c7df84.1557769318.git.len.brown@intel.com

drivers/hwmon/coretemp.c

@@ -435,7 +435,7 @@ static int chk_ucode_version(unsigned int cpu)
 
 static struct platform_device *coretemp_get_pdev(unsigned int cpu)
 {
-	int pkgid = topology_logical_package_id(cpu);
+	int pkgid = topology_logical_die_id(cpu);
 
 	if (pkgid >= 0 && pkgid < max_packages)
 		return pkg_devices[pkgid];
@@ -579,7 +579,7 @@ static struct platform_driver coretemp_driver = {
 
 static struct platform_device *coretemp_device_add(unsigned int cpu)
 {
-	int err, pkgid = topology_logical_package_id(cpu);
+	int err, pkgid = topology_logical_die_id(cpu);
 	struct platform_device *pdev;
 
 	if (pkgid < 0)
@@ -703,7 +703,7 @@ static int coretemp_cpu_offline(unsigned int cpu)
 	 * the rest.
 	 */
 	if (cpumask_empty(&pd->cpumask)) {
-		pkg_devices[topology_logical_package_id(cpu)] = NULL;
+		pkg_devices[topology_logical_die_id(cpu)] = NULL;
 		platform_device_unregister(pdev);
 		return 0;
 	}
@@ -741,7 +741,7 @@ static int __init coretemp_init(void)
 	if (!x86_match_cpu(coretemp_ids))
 		return -ENODEV;
 
-	max_packages = topology_max_packages();
+	max_packages = topology_max_packages() * topology_max_die_per_package();
 	pkg_devices = kcalloc(max_packages, sizeof(struct platform_device *),
 			      GFP_KERNEL);
 	if (!pkg_devices)