• Linus Torvalds's avatar
    Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux · 91466574
    Linus Torvalds authored
    Pull thermal management updates from Zhang Rui:
     "This time, the biggest change is the work of representing hardware
      thermal properties in device tree infrastructure.
    
      This work includes the introduction of a device tree bindings for
      describing the hardware thermal behavior and limits, and also a parser
      to read and interpret the data, and build thermal zones and thermal
      binding parameters.  It also contains three examples on how to use the
      new representation on sensor devices, using three different drivers to
      accomplish it.  One driver is in thermal subsystem, the TI SoC
      thermal, and the other two drivers are in hwmon subsystem.
    
      Actually, this would be the first step of the complete work because we
      still need to check other potential drivers to be converted and then
      validate the proposed API.  But the reason why I include it in this
      pull request is that, first, this change does not hurt any others
      without using this approach, second, the principle and concept of this
      change would not break after converting the remaining drivers.  BTW,
      as you can see, there are several points in this change that do not
      belong to thermal subsystem.  Because it has been suggested by Guenter
      R that in such cases, it is recommended to send the complete series
      via one single subsystem.
    
      Specifics:
    
       - representing hardware thermal properties in device tree
         infrastructure
    
       - fix a regression that the imx thermal driver breaks system suspend.
    
       - introduce ACPI INT3403 thermal driver to retrieve temperature data
         from the INT3403 ACPI device object present on some systems.
    
       - introduce debug statement for thermal core and step_wise governor.
    
       - assorted fixes and cleanups for thermal core, cpu cooling, exynos
         thrmal, intel powerclamp and imx thermal driver"
    
    * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (34 commits)
      thermal: remove const flag from .ops of imx thermal
      Thermal: update thermal zone device after setting emul_temp
      intel_powerclamp: Fix cstate counter detection.
      thermal: imx: add necessary clk operation
      Thermal cpu cooling: return error if no valid cpu frequency entry
      thermal: fix cpu_cooling max_level behavior
      thermal: rcar-thermal: Enable driver compilation with COMPILE_TEST
      thermal: debug: add debug statement for core and step_wise
      thermal: imx_thermal: add module device table
      drivers: thermal: Mark function as static in x86_pkg_temp_thermal.c
      thermal:samsung: fix compilation warning
      thermal: imx: correct suspend/resume flow
      thermal: exynos: fix error return code
      Thermal: ACPI INT3403 thermal driver
      MAINTAINERS: add thermal bindings entry in thermal domain
      arm: dts: make OMAP4460 bandgap node to belong to OCP
      arm: dts: make OMAP443x bandgap node to belong to OCP
      arm: dts: add cooling properties on omap5 cpu node
      arm: dts: add omap5 thermal data
      arm: dts: add omap5 CORE thermal data
      ...
    91466574
cpufreq-cpu0.c 6.35 KB