This binding is currently used for SDIO devices, but these chips are
also used as PCIe devices on DT platforms and may be represented in the
DT. Re-use the existing binding and add chip compatibles used by Apple
T2 and M1 platforms (the T2 ones are not known to be used in DT
platforms, but we might as well document them).

Then, add properties required for firmware selection and calibration on
M1 machines.
Reviewed-by: Linus Walleij <linus.walleij@linaro.org>
Signed-off-by: Hector Martin <marcan@marcan.st>
Reviewed-by: Mark Kettenis <kettenis@openbsd.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Alvin Šipraga <alsi@bang-olufsen.dk>
Signed-off-by: Russell King (Oracle) <rmk+kernel@armlinux.org.uk>
Signed-off-by: Kalle Valo <kvalo@kernel.org>
Link: https://lore.kernel.org/r/E1oZDnO-0077Zy-18@rmk-PC.armlinux.org.uk