ASoC: SOF: Intel: start splitting top-level from common parts
The existing code relies on the 'HDA_COMMON' module and namespace. We need to start splitting top-level parts from the low-level ones, otherwise we will not be able to reuse the low-level parts DMA support for SoundWire/BPT. In the end the dependencies will be: +----------------------------------------------+ | | | v sof-pci-intel-xxx --> sof-intel-hda ------------> sof-hda-common | ^ | | +-> soundwire_intel --> sof_hda_sdw_bpt This patch adds the initial split between the sof-pci-intel-xxx modules and the common parts, in a follow-up patch we will further split the HDA_COMMON parts Since the PCI modules are not all independent, i.e. the CNL parts are also used in JSL and TGL, additional Kconfig and namespace modules were added. Signed-off-by: Pierre-Louis Bossart <pierre-louis.bossart@linux.intel.com> Reviewed-by: Bard Liao <yung-chuan.liao@linux.intel.com> Reviewed-by: Ranjani Sridharan <ranjani.sridharan@linux.intel.com> Link: https://lore.kernel.org/r/20240503135221.229202-4-pierre-louis.bossart@linux.intel.comSigned-off-by: Mark Brown <broonie@kernel.org>
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