usb: musb: Drop old unused am35x glue layer

The am35x glue layer is no longer in use and can be dropped. There are no
longer any SoCs passing platform data for it as they are booting using
devicetree.

In general, the am35x SoCs are similar to am335x and ti81xx and can
use the musb_dsps glue layer as long as there is a proper phy driver
available.

Cc: Arnd Bergmann <arnd@arndb.de>
Signed-off-by: Tony Lindgren <tony@atomide.com>
Link: https://lore.kernel.org/r/20221125085506.38127-1-tony@atomide.comSigned-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>

drivers/usb/musb/Kconfig

@@ -88,11 +88,6 @@ config USB_MUSB_OMAP2PLUS
 	depends on OMAP_CONTROL_PHY || !OMAP_CONTROL_PHY
 	select GENERIC_PHY
 
-config USB_MUSB_AM35X
-	tristate "AM35x"
-	depends on ARCH_OMAP
-	depends on NOP_USB_XCEIV
-
 config USB_MUSB_DSPS
 	tristate "TI DSPS platforms"
 	depends on ARCH_OMAP2PLUS || COMPILE_TEST

drivers/usb/musb/Makefile

@@ -16,7 +16,6 @@ musb_hdrc-$(CONFIG_DEBUG_FS)			+= musb_debugfs.o
 
 # Hardware Glue Layer
 obj-$(CONFIG_USB_MUSB_OMAP2PLUS)		+= omap2430.o
-obj-$(CONFIG_USB_MUSB_AM35X)			+= am35x.o
 obj-$(CONFIG_USB_MUSB_DSPS)			+= musb_dsps.o
 obj-$(CONFIG_USB_MUSB_TUSB6010)			+= tusb6010.o
 obj-$(CONFIG_USB_MUSB_DA8XX)			+= da8xx.o