Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux

Pull thermal management fixes from Zhang Rui:

 - Power allocator governor changes to allow binding on thermal zones
   with missing power estimates information.  From Javi Merino.

 - Add compile test flags on thermal drivers that allow it without
   producing compilation errors.  From Eduardo Valentin.

 - Fixes around memory allocation on cpu_cooling.  From Javi Merino.

 - Fix on db8500 cpufreq code to allow autoload.  From Luis de
   Bethencourt.

 - Maintainer entries for cpu cooling device

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
  thermal: power_allocator: exit early if there are no cooling devices
  thermal: power_allocator: don't require tzp to be present for the thermal zone
  thermal: power_allocator: relax the requirement of two passive trip points
  thermal: power_allocator: relax the requirement of a sustainable_power in tzp
  thermal: Add a function to get the minimum power
  thermal: cpu_cooling: free power table on error or when unregistering
  thermal: cpu_cooling: don't call kcalloc() under rcu_read_lock
  thermal: db8500_cpufreq_cooling: Fix module autoload for OF platform driver
  thermal: cpu_cooling: Add MAINTAINERS entry
  thermal: ti-soc: Kconfig fix to avoid menu showing wrongly
  thermal: ti-soc: allow compile test
  thermal: qcom_spmi: allow compile test
  thermal: exynos: allow compile test
  thermal: armada: allow compile test
  thermal: dove: allow compile test
  thermal: kirkwood: allow compile test
  thermal: rockchip: allow compile test
  thermal: spear: allow compile test
  thermal: hisi: allow compile test
  thermal: Fix thermal_zone_of_sensor_register to match documentation

Documentation/thermal/power_allocator.txt

@@ -4,7 +4,7 @@ Power allocator governor tunables
 Trip points
 -----------
 
-The governor requires the following two passive trip points:
+The governor works optimally with the following two passive trip points:
 
 1.  "switch on" trip point: temperature above which the governor
     control loop starts operating.  This is the first passive trip

MAINTAINERS

@@ -10338,6 +10338,16 @@ F:	include/uapi/linux/thermal.h
 F:	include/linux/cpu_cooling.h
 F:	Documentation/devicetree/bindings/thermal/
 
+THERMAL/CPU_COOLING
+M:	Amit Daniel Kachhap <amit.kachhap@gmail.com>
+M:	Viresh Kumar <viresh.kumar@linaro.org>
+M:	Javi Merino <javi.merino@arm.com>
+L:	linux-pm@vger.kernel.org
+S:	Supported
+F:	Documentation/thermal/cpu-cooling-api.txt
+F:	drivers/thermal/cpu_cooling.c
+F:	include/linux/cpu_cooling.h
+
 THINGM BLINK(1) USB RGB LED DRIVER
 M:	Vivien Didelot <vivien.didelot@savoirfairelinux.com>
 S:	Maintained

drivers/thermal/Kconfig

@@ -163,7 +163,7 @@ config THERMAL_EMULATION
 
 config HISI_THERMAL
 	tristate "Hisilicon thermal driver"
-	depends on ARCH_HISI && CPU_THERMAL && OF
+	depends on (ARCH_HISI && CPU_THERMAL && OF) || COMPILE_TEST
 	help
 	  Enable this to plug hisilicon's thermal sensor driver into the Linux
 	  thermal framework. cpufreq is used as the cooling device to throttle
@@ -182,7 +182,7 @@ config IMX_THERMAL
 
 config SPEAR_THERMAL
 	bool "SPEAr thermal sensor driver"
-	depends on PLAT_SPEAR
+	depends on PLAT_SPEAR || COMPILE_TEST
 	depends on OF
 	help
 	  Enable this to plug the SPEAr thermal sensor driver into the Linux
@@ -190,7 +190,7 @@ config SPEAR_THERMAL
 
 config ROCKCHIP_THERMAL
 	tristate "Rockchip thermal driver"
-	depends on ARCH_ROCKCHIP
+	depends on ARCH_ROCKCHIP || COMPILE_TEST
 	depends on RESET_CONTROLLER
 	help
 	  Rockchip thermal driver provides support for Temperature sensor
@@ -208,7 +208,7 @@ config RCAR_THERMAL
 
 config KIRKWOOD_THERMAL
 	tristate "Temperature sensor on Marvell Kirkwood SoCs"
-	depends on MACH_KIRKWOOD
+	depends on MACH_KIRKWOOD || COMPILE_TEST
 	depends on OF
 	help
 	  Support for the Kirkwood thermal sensor driver into the Linux thermal
@@ -216,7 +216,7 @@ config KIRKWOOD_THERMAL
 
 config DOVE_THERMAL
 	tristate "Temperature sensor on Marvell Dove SoCs"
-	depends on ARCH_DOVE || MACH_DOVE
+	depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
 	depends on OF
 	help
 	  Support for the Dove thermal sensor driver in the Linux thermal
@@ -234,7 +234,7 @@ config DB8500_THERMAL
 
 config ARMADA_THERMAL
 	tristate "Armada 370/XP thermal management"
-	depends on ARCH_MVEBU
+	depends on ARCH_MVEBU || COMPILE_TEST
 	depends on OF
 	help
 	  Enable this option if you want to have support for thermal management
@@ -349,11 +349,12 @@ config INTEL_PCH_THERMAL
 	  programmable trip points and other information.
 
 menu "Texas Instruments thermal drivers"
+depends on ARCH_HAS_BANDGAP || COMPILE_TEST
 source "drivers/thermal/ti-soc-thermal/Kconfig"
 endmenu
 
 menu "Samsung thermal drivers"
-depends on ARCH_EXYNOS
+depends on ARCH_EXYNOS || COMPILE_TEST
 source "drivers/thermal/samsung/Kconfig"
 endmenu
 
@@ -364,7 +365,7 @@ endmenu
 
 config QCOM_SPMI_TEMP_ALARM
 	tristate "Qualcomm SPMI PMIC Temperature Alarm"
-	depends on OF && SPMI && IIO
+	depends on OF && (SPMI || COMPILE_TEST) && IIO
 	select REGMAP_SPMI
 	help
 	  This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP)

drivers/thermal/cpu_cooling.c

@@ -262,7 +262,9 @@ static int cpufreq_thermal_notifier(struct notifier_block *nb,
  * efficiently.  Power is stored in mW, frequency in KHz.  The
  * resulting table is in ascending order.
  *
- * Return: 0 on success, -E* on error.
+ * Return: 0 on success, -EINVAL if there are no OPPs for any CPUs,
+ * -ENOMEM if we run out of memory or -EAGAIN if an OPP was
+ * added/enabled while the function was executing.
  */
 static int build_dyn_power_table(struct cpufreq_cooling_device *cpufreq_device,
 				 u32 capacitance)
@@ -273,8 +275,6 @@ static int build_dyn_power_table(struct cpufreq_cooling_device *cpufreq_device,
 	int num_opps = 0, cpu, i, ret = 0;
 	unsigned long freq;
 
-	rcu_read_lock();
-
 	for_each_cpu(cpu, &cpufreq_device->allowed_cpus) {
 		dev = get_cpu_device(cpu);
 		if (!dev) {
@@ -284,24 +284,20 @@ static int build_dyn_power_table(struct cpufreq_cooling_device *cpufreq_device,
 		}
 
 		num_opps = dev_pm_opp_get_opp_count(dev);
-		if (num_opps > 0) {
+		if (num_opps > 0)
 			break;
-		} else if (num_opps < 0) {
-			ret = num_opps;
-			goto unlock;
-		}
+		else if (num_opps < 0)
+			return num_opps;
 	}
 
-	if (num_opps == 0) {
-		ret = -EINVAL;
-		goto unlock;
-	}
+	if (num_opps == 0)
+		return -EINVAL;
 
 	power_table = kcalloc(num_opps, sizeof(*power_table), GFP_KERNEL);
-	if (!power_table) {
-		ret = -ENOMEM;
-		goto unlock;
-	}
+	if (!power_table)
+		return -ENOMEM;
+
+	rcu_read_lock();
 
 	for (freq = 0, i = 0;
 	     opp = dev_pm_opp_find_freq_ceil(dev, &freq), !IS_ERR(opp);
@@ -309,6 +305,12 @@ static int build_dyn_power_table(struct cpufreq_cooling_device *cpufreq_device,
 		u32 freq_mhz, voltage_mv;
 		u64 power;
 
+		if (i >= num_opps) {
+			rcu_read_unlock();
+			ret = -EAGAIN;
+			goto free_power_table;
+		}
+
 		freq_mhz = freq / 1000000;
 		voltage_mv = dev_pm_opp_get_voltage(opp) / 1000;
 
@@ -326,17 +328,22 @@ static int build_dyn_power_table(struct cpufreq_cooling_device *cpufreq_device,
 		power_table[i].power = power;
 	}
 
-	if (i == 0) {
+	rcu_read_unlock();
+
+	if (i != num_opps) {
 		ret = PTR_ERR(opp);
-		goto unlock;
+		goto free_power_table;
 	}
 
 	cpufreq_device->cpu_dev = dev;
 	cpufreq_device->dyn_power_table = power_table;
 	cpufreq_device->dyn_power_table_entries = i;
 
-unlock:
-	rcu_read_unlock();
+	return 0;
+
+free_power_table:
+	kfree(power_table);
+
 	return ret;
 }
 
@@ -847,7 +854,7 @@ __cpufreq_cooling_register(struct device_node *np,
 	ret = get_idr(&cpufreq_idr, &cpufreq_dev->id);
 	if (ret) {
 		cool_dev = ERR_PTR(ret);
-		goto free_table;
+		goto free_power_table;
 	}
 
 	snprintf(dev_name, sizeof(dev_name), "thermal-cpufreq-%d",
@@ -889,6 +896,8 @@ __cpufreq_cooling_register(struct device_node *np,
 
 remove_idr:
 	release_idr(&cpufreq_idr, cpufreq_dev->id);
+free_power_table:
+	kfree(cpufreq_dev->dyn_power_table);
 free_table:
 	kfree(cpufreq_dev->freq_table);
 free_time_in_idle_timestamp:
@@ -1039,6 +1048,7 @@ void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
 
 	thermal_cooling_device_unregister(cpufreq_dev->cool_dev);
 	release_idr(&cpufreq_idr, cpufreq_dev->id);
+	kfree(cpufreq_dev->dyn_power_table);
 	kfree(cpufreq_dev->time_in_idle_timestamp);
 	kfree(cpufreq_dev->time_in_idle);
 	kfree(cpufreq_dev->freq_table);

drivers/thermal/db8500_cpufreq_cooling.c

@@ -72,6 +72,7 @@ static const struct of_device_id db8500_cpufreq_cooling_match[] = {
 	{ .compatible = "stericsson,db8500-cpufreq-cooling" },
 	{},
 };
+MODULE_DEVICE_TABLE(of, db8500_cpufreq_cooling_match);
 #endif
 
 static struct platform_driver db8500_cpufreq_cooling_driver = {

drivers/thermal/thermal_core.c

@@ -1012,6 +1012,34 @@ int power_actor_get_max_power(struct thermal_cooling_device *cdev,
 	return cdev->ops->state2power(cdev, tz, 0, max_power);
 }
 
+/**
+ * power_actor_get_min_power() - get the mainimum power that a cdev can consume
+ * @cdev:	pointer to &thermal_cooling_device
+ * @tz:		a valid thermal zone device pointer
+ * @min_power:	pointer in which to store the minimum power
+ *
+ * Calculate the minimum power consumption in milliwatts that the
+ * cooling device can currently consume and store it in @min_power.
+ *
+ * Return: 0 on success, -EINVAL if @cdev doesn't support the
+ * power_actor API or -E* on other error.
+ */
+int power_actor_get_min_power(struct thermal_cooling_device *cdev,
+			      struct thermal_zone_device *tz, u32 *min_power)
+{
+	unsigned long max_state;
+	int ret;
+
+	if (!cdev_is_power_actor(cdev))
+		return -EINVAL;
+
+	ret = cdev->ops->get_max_state(cdev, &max_state);
+	if (ret)
+		return ret;
+
+	return cdev->ops->state2power(cdev, tz, max_state, min_power);
+}
+
 /**
  * power_actor_set_power() - limit the maximum power that a cooling device can consume
  * @cdev:	pointer to &thermal_cooling_device

drivers/thermal/ti-soc-thermal/Kconfig

 config TI_SOC_THERMAL
 	tristate "Texas Instruments SoCs temperature sensor driver"
-	depends on THERMAL
-	depends on ARCH_HAS_BANDGAP
 	help
 	  If you say yes here you get support for the Texas Instruments
 	  OMAP4460+ on die bandgap temperature sensor support. The register
@@ -24,7 +22,7 @@ config TI_THERMAL
 config OMAP4_THERMAL
 	bool "Texas Instruments OMAP4 thermal support"
 	depends on TI_SOC_THERMAL
-	depends on ARCH_OMAP4
+	depends on ARCH_OMAP4 || COMPILE_TEST
 	help
 	  If you say yes here you get thermal support for the Texas Instruments
 	  OMAP4 SoC family. The current chip supported are:
@@ -38,7 +36,7 @@ config OMAP4_THERMAL
 config OMAP5_THERMAL
 	bool "Texas Instruments OMAP5 thermal support"
 	depends on TI_SOC_THERMAL
-	depends on SOC_OMAP5
+	depends on SOC_OMAP5 || COMPILE_TEST
 	help
 	  If you say yes here you get thermal support for the Texas Instruments
 	  OMAP5 SoC family. The current chip supported are:
@@ -50,7 +48,7 @@ config OMAP5_THERMAL
 config DRA752_THERMAL
 	bool "Texas Instruments DRA752 thermal support"
 	depends on TI_SOC_THERMAL
-	depends on SOC_DRA7XX
+	depends on SOC_DRA7XX || COMPILE_TEST
 	help
 	  If you say yes here you get thermal support for the Texas Instruments
 	  DRA752 SoC family. The current chip supported are:

include/linux/thermal.h

@@ -360,7 +360,7 @@ static inline struct thermal_zone_device *
 thermal_zone_of_sensor_register(struct device *dev, int id, void *data,
 				const struct thermal_zone_of_device_ops *ops)
 {
-	return NULL;
+	return ERR_PTR(-ENODEV);
 }
 
 static inline
@@ -380,6 +380,8 @@ static inline bool cdev_is_power_actor(struct thermal_cooling_device *cdev)
 
 int power_actor_get_max_power(struct thermal_cooling_device *,
 			      struct thermal_zone_device *tz, u32 *max_power);
+int power_actor_get_min_power(struct thermal_cooling_device *,
+			      struct thermal_zone_device *tz, u32 *min_power);
 int power_actor_set_power(struct thermal_cooling_device *,
 			  struct thermal_instance *, u32);
 struct thermal_zone_device *thermal_zone_device_register(const char *, int, int,
@@ -415,6 +417,10 @@ static inline bool cdev_is_power_actor(struct thermal_cooling_device *cdev)
 static inline int power_actor_get_max_power(struct thermal_cooling_device *cdev,
 			      struct thermal_zone_device *tz, u32 *max_power)
 { return 0; }
+static inline int power_actor_get_min_power(struct thermal_cooling_device *cdev,
+					    struct thermal_zone_device *tz,
+					    u32 *min_power)
+{ return -ENODEV; }
 static inline int power_actor_set_power(struct thermal_cooling_device *cdev,
 			  struct thermal_instance *tz, u32 power)
 { return 0; }