- 07 Apr, 2023 19 commits
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Daniel Lezcano authored
The caller of the function thermal_zone_device_register_with_trips() can pass a thermal_zone_params structure parameter. This one is used by the thermal core code until the thermal zone is destroyed. That forces the caller, so the driver, to keep the pointer valid until it unregisters the thermal zone if we want to make the thermal zone device structure private the core code. As the thermal zone device structure would be private, the driver can not access to thermal zone device structure to retrieve the tzp field after it passed it to register the thermal zone. So instead of forcing the users of the function to deal with the tzp structure life cycle, make the usage easier by allocating our own thermal zone params, copying the parameter content and by freeing at unregister time. The user can then create the parameters on the stack, pass it to the registering function and forget about it. Signed-off-by:
Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230404075138.2914680-3-daniel.lezcano@linaro.org
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Daniel Lezcano authored
The functions thermal_of_zone_register() and thermal_of_zone_unregister() are no longer needed from the drivers as the devm_ variant is always used. Make them static in the C file and remove their declaration from thermal.h Signed-off-by:
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Daniel Lezcano authored
The driver is using the devm_thermal_of_zone_device_register(). In the error path of the function calling devm_thermal_of_zone_device_register(), the function devm_thermal_of_zone_unregister() should be called instead of thermal_of_zone_unregister(), otherwise this one will be called twice when the device is freed. The same happens for the remove function where the devm_ guarantee the thermal_of_zone_unregister() will be called, so adding this call in the remove function will lead to a double free also. Use devm_ variant in the error path of the probe function. Remove thermal_of_zone_unregister() in the remove function. Cc: Florian Fainelli <f.fainelli@gmail.com> Cc: Ray Jui <rjui@broadcom.com> Cc: Scott Branden <sbranden@broadcom.com> Signed-off-by:
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Balsam CHIHI authored
Add MT8195 AP Domain support to LVTS Driver. Take the opportunity to update the comments to show calibration data information related to the new domain. [dlezcano]: Massaged a bit the changelog Signed-off-by:
Balsam CHIHI <bchihi@baylibre.com> Tested-by:
Chen-Yu Tsai <wenst@chromium.org> Signed-off-by:
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Balsam CHIHI authored
Add AP Domain to LVTS thermal controllers dt-binding definition for mt8195. Signed-off-by:
Rob Herring <robh@kernel.org> Reviewed-by:
AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> Tested-by:
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Ye Xingchen authored
Replace the open-code with dev_err_probe() to simplify the code. Signed-off-by:
Ye Xingchen <ye.xingchen@zte.com.cn> Reviewed-by:
Neil Armstrong <neil.armstrong@linaro.org> Reviewed-by:
Martin Blumenstingl <martin.blumenstingl@googlemail.com> Signed-off-by:
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Chen-Yu Tsai authored
The binary representation for sensor 1 interrupt status was incorrectly assembled, when compared to the full table given in the same comment section. The conversion into hex was also incorrect, leading to incorrect interrupt status bitmask for sensor 1. This would cause the driver to incorrectly identify changes for sensor 1, when in fact it was sensor 0, or a sensor access time out. Fix the binary and hex representations in the comments, and the actual bitmask macro. Fixes: f5f633b1 ("thermal/drivers/mediatek: Add the Low Voltage Thermal Sensor driver") Signed-off-by:
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Lukas Bulwahn authored
Commit 32a7a021 ("thermal/core: Relocate the traces definition in thermal directory") moves include/trace/events/thermal_power_allocator.h to drivers/thermal/thermal_trace_ipa.h, but misses to adjust the file entry for the THERMAL/POWER_ALLOCATOR section. Hence, ./scripts/get_maintainer.pl --self-test=patterns complains about a broken reference. Adjust this file entry in THERMAL/POWER_ALLOCATOR. Signed-off-by:
Lukas Bulwahn <lukas.bulwahn@gmail.com> Reviewed-by:
Lukasz Luba <lukasz.luba@arm.com> Signed-off-by:
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Rob Herring authored
Cleanup bindings dropping unneeded quotes. Once all these are fixed, checking for this can be enabled in yamllint. Signed-off-by:
Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by:
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Zhang Rui authored
Remove struct thermal_bind_params because no one is using it for thermal binding now. Signed-off-by:
Zhang Rui <rui.zhang@intel.com> Signed-off-by:
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Mikko Perttunen authored
Thermal zones located in power domains may not be accessible when the domain is powergated. In this situation, reading the temperature will return -BPMP_EFAULT. When evaluating trips, BPMP will internally use -256C as the temperature for offline zones. For smooth operation, for offline zones, return -EAGAIN when reading the temperature and allow registration of zones even if they are offline during probe. Signed-off-by:
Mikko Perttunen <mperttunen@nvidia.com> Acked-by:
Thierry Reding <treding@nvidia.com> Signed-off-by:
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Ye Xingchen authored
Switch devm_reset_control_array_get() to devm_reset_control_array_get_exclusive(). Signed-off-by:
Philipp Zabel <p.zabel@pengutronix.de> Signed-off-by:
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Sebastian Reichel authored
Add a new compatible for the thermal sensor device on RK3588 SoCs. Reviewed-by:
Heiko Stuebner <heiko@sntech.de> Acked-by:
Sebastian Reichel <sebastian.reichel@collabora.com> Signed-off-by:
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Finley Xiao authored
The RK3588 SoC has seven temperature sensor ADC channels: - Chip Center - CPU Cluster 1 (Dual A76 "Big" Cores) - CPU Cluster 2 (Dual A76 "Big" Cores) - CPU Cluster 0 (Quad A55 "Little" Cores) - Power Domain Center - Graphics Processing Unit - Neural Processing Unit Signed-off-by:
Finley Xiao <finley.xiao@rock-chips.com> [rebase, squash fixes] Reviewed-by:
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Sebastian Reichel authored
Dynamically allocate the sensors array based on the amount of platform sensors in preparation for rk3588 support, which needs 7 sensors. Reviewed-by:
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Sebastian Reichel authored
Replace the channel ID lookup table by a simple offset, since the channel IDs are consecutive. Signed-off-by:
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Sebastian Reichel authored
Use dev_err_probe to simplify error printing in the driver's probe routine. Reviewed-by:
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Sebastian Reichel authored
By using devm_clk_get_enabled() the clock acquisition and enabling can be done in one step with automatic error handling. Reviewed-by:
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Sebastian Reichel authored
It's possible to directly get the match data in a generic way nowadays. Reviewed-by:
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- 03 Apr, 2023 2 commits
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ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linuxRafael J. Wysocki authored
Pull thermal control material for 6.4-rc1 from Daniel Lezcano: "- Add more thermal zone device encapsulation: prevent setting structure field directly, access the sensor device instead the thermal zone's device for trace, relocate the traces in drivers/thermal (Daniel Lezcano) - Use the generic trip point for the i.MX and remove the get_trip_temp ops (Daniel Lezcano) - Use the devm_platform_ioremap_resource() in the Hisilicon driver (Yang Li) - Remove R-Car H3 ES1.* handling as public has only access to the ES2 version and the upstream support for the ES1 has been shutdown (Wolfram Sang) - Add a delay after initializing the bank in order to let the time to the hardware to initialze itself before reading the temperature (Amjad Ouled-Ameur) - Add MT8365 support (Amjad Ouled-Ameur)" * tag 'thermal-v6.4-rc1-1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux: thermal/drivers/ti: Use fixed update interval thermal/drivers/stm: Don't set no_hwmon to false thermal/drivers/db8500: Use driver dev instead of tz->device thermal/core: Relocate the traces definition in thermal directory thermal/drivers/hisi: Use devm_platform_ioremap_resource() thermal/drivers/imx: Use the thermal framework for the trip point thermal/drivers/imx: Remove get_trip_temp ops thermal/drivers/rcar_gen3_thermal: Remove R-Car H3 ES1.* handling thermal/drivers/mediatek: Add delay after thermal banks initialization thermal/drivers/mediatek: Add support for MT8365 SoC thermal/drivers/mediatek: Control buffer enablement tweaks dt-bindings: thermal: mediatek: Add binding documentation for MT8365 SoC
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Rafael J. Wysocki authored
Once thermal_list_lock has been acquired in __thermal_cooling_device_register(), it is not necessary to drop it and take it again until all of the thermal zones have been updated, so change the code accordingly. No expected functional impact. Signed-off-by:Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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- 01 Apr, 2023 9 commits
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Daniel Lezcano authored
Currently the TI thermal driver sets the sensor update interval based on the polling of the thermal zone. In order to get the polling rate, the code inspects the thermal zone device structure internals, thus breaking the self-encapsulation of the thermal framework core framework. On the other side, we see the common polling rates set in the device tree for the platforms using this driver are 500 or 1000 ms. Setting the polling rate to 250 ms would be far enough to cover the combination we found in the device tree. Instead of accessing the thermal zone device structure polling rate, let's use a common update interval of 250 ms for the driver. Cc: Keerthy <j-keerthy@ti.com> Signed-off-by:
Dhruva Gole <d-gole@ti.com> Acked-by:
Keerthy <j-keerthy@ti.com> Link: https://lore.kernel.org/r/20230307133735.90772-7-daniel.lezcano@linaro.org
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Daniel Lezcano authored
The thermal->tzp->no_hwmon parameter is only used when calling thermal_zone_device_register(). Setting it to 'false' before calling thermal_add_hwmon_sysfs() has no effect. Remove the call and again prevent the drivers to access the thermal internals. Cc: Maxime Coquelin <mcoquelin.stm32@gmail.com> Cc: Alexandre Torgue <alexandre.torgue@foss.st.com> Signed-off-by:
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Daniel Lezcano authored
The db8500 driver uses the thermal zone device instead of the device attached to it. In order to prevent the drivers to access the thermal zone device structure, replace the thermal zone device by the driver to show the debug message. Cc: Linus Walleij <linus.walleij@linaro.org> Signed-off-by:
Linus Walleij <linus.walleij@linaro.org> Link: https://lore.kernel.org/r/20230307133735.90772-5-daniel.lezcano@linaro.org
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Daniel Lezcano authored
The traces are exported but only local to the thermal core code. On the other side, the traces take the thermal zone device structure as argument, thus they have to rely on the exported thermal.h header file. As we want to move the structure to the private thermal core header, first we have to relocate those traces to the same place as many drivers do. Cc: Steven Rostedt <rostedt@goodmis.org> Suggested-by:
Steven Rostedt <rostedt@goodmis.org> Signed-off-by:
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Yang Li authored
According to commit 7945f929 ("drivers: provide devm_platform_ioremap_resource()"), convert platform_get_resource(), devm_ioremap_resource() to a single call to Use devm_platform_ioremap_resource(), as this is exactly what this function does. Signed-off-by:
Yang Li <yang.lee@linux.alibaba.com> Link: https://lore.kernel.org/r/20230308062719.79522-1-yang.lee@linux.alibaba.comSigned-off-by:
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Daniel Lezcano authored
The thermal framework provides an API to get the trip related to a trip point id. We want to consolidate the generic trip points code, thus preventing the different drivers to deal with the trip points after they registered them. The set_trip_temp ops will be changed regarding the above changes but first we need to rework a bit the different implementation in the drivers. The goal is to prevent using the trip id but use a trip point passed as parameter which will contain all the needed information. As we don't have the trip point passed as parameter yet, we get the trip point using the generic trip thermal framewrok APIs and use it to take exactly the same decisions. The difference with this change and the previous code is from where we get the thermal trip point (which is the same). No functional change intended. Signed-off-by:
Fabio Estevam <festevam@gmail.com> Link: https://lore.kernel.org/r/20230309092821.1590586-2-daniel.lezcano@linaro.orgSigned-off-by:
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Daniel Lezcano authored
The i.MX thermal sensor uses the generic trip points. The thermal framework can return the critical temperature directly. Remove the pointless get_trip_temp ops. Signed-off-by:
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Wolfram Sang authored
R-Car H3 ES1.* was only available to an internal development group and needed a lot of quirks and workarounds. These become a maintenance burden now, so our development group decided to remove upstream support and disable booting for this SoC. Public users only have ES2 onwards. Reviewed-by:
Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com> Reviewed-by:
Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by:
Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by:
Wolfram Sang <wsa+renesas@sang-engineering.com> Link: https://lore.kernel.org/r/20230307163041.3815-7-wsa+renesas@sang-engineering.comSigned-off-by:
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Amjad Ouled-Ameur authored
Thermal sensor reads performed immediately after thermal bank initialization returns bogus values. This is currently tackled by returning 0 if the temperature is bogus (exceeding 200000). Instead, add a delay between the bank init and the thermal zone device register to properly fix this. Signed-off-by:
Michael Kao <michael.kao@mediatek.com> Signed-off-by:
Hsin-Yi Wang <hsinyi@chromium.org> Signed-off-by:
Amjad Ouled-Ameur <aouledameur@baylibre.com> Reviewed-by:
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- 31 Mar, 2023 2 commits
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Rafael J. Wysocki authored
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Rafael J. Wysocki authored
Merge Intel thermal driver fixes for 6.3-rc5: - Fix handling of two recently added module parameters in the Intel powerclamp thermal driver (David Arcari). - Fix one more deadlock in the int340x thermal driver (Srinivas Pandruvada). * thermal-intel-fixes: thermal: intel: powerclamp: Fix cpumask and max_idle module parameters thermal: intel: int340x: processor_thermal: Fix additional deadlock
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- 30 Mar, 2023 2 commits
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David Arcari authored
When cpumask is specified as a module parameter the value is overwritten by the module init routine. This can easily be fixed by checking to see if the mask has already been allocated in the init routine. When max_idle is specified as a module parameter a panic will occur. The problem is that the idle_injection_cpu_mask is not allocated until the module init routine executes. This can easily be fixed by allocating the cpumask if it's not already allocated. Fixes: ebf51971 ("thermal: intel: powerclamp: Add two module parameters") Signed-off-by:
David Arcari <darcari@redhat.com> Reviewed-by: Srinivas Pandruvada<srinivas.pandruvada@linux.intel.com> Signed-off-by:
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Rob Herring authored
It is preferred to use typed property access functions (i.e. of_property_read_<type> functions) rather than low-level of_get_property/of_find_property functions for reading properties. As part of this, convert of_get_property/of_find_property calls to the recently added of_property_present() helper when we just want to test for presence of a property and nothing more. Signed-off-by:
Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by:
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- 29 Mar, 2023 3 commits
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Rafael J. Wysocki authored
For the sake of consistency, revert the second part of the thermal_hwmon.c hunk from commit dec07d39 ("thermal: Don't use 'device' internal thermal zone structure field") after the first part of it has been reverted. Link: https://lore.kernel.org/linux-pm/5b084360-898b-aad0-0b8e-33acc585d71d@linaro.orgSigned-off-by:
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Srinivas Pandruvada authored
Commit 52f04f10 ("thermal: intel: int340x: processor_thermal: Fix deadlock") addressed deadlock issue during user space trip update. But it missed a case when thermal zone device is disabled when user writes 0. Call to thermal_zone_device_disable() also causes deadlock as it also tries to lock tz->lock, which is already claimed by trip_point_temp_store() in the thermal core code. Remove call to thermal_zone_device_disable() in the function sys_set_trip_temp(), which is called from trip_point_temp_store(). Fixes: 52f04f10 ("thermal: intel: int340x: processor_thermal: Fix deadlock") Signed-off-by:
Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Cc: 6.2+ <stable@vger.kernel.org> # 6.2+ Signed-off-by:
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Zhang Rui authored
When the hwmon device node of a thermal zone device is not found, using hwmon->device causes a kernel NULL pointer dereference. Fixes: dec07d39 ("thermal: Don't use 'device' internal thermal zone structure field") Reported-by:
Preble Adam C <adam.c.preble@intel.com> Signed-off-by:
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- 28 Mar, 2023 1 commit
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Rafael J. Wysocki authored
The lockdep_assert_held() calls added to cooling_device_stats_setup() and cooling_device_stats_destroy() by commit 790930f4 ("thermal: core: Introduce thermal_cooling_device_update()") trigger false-positive lockdep reports in code paths that are not subject to race conditions (before cooling device registration and after cooling device removal). For this reason, remove the lockdep_assert_held() calls from both cooling_device_stats_setup() and cooling_device_stats_destroy() and add one to thermal_cooling_device_stats_reinit() that has to be called under the cdev lock. Fixes: 790930f4 ("thermal: core: Introduce thermal_cooling_device_update()") Link: https://lore.kernel.org/linux-acpi/ZCIDTLFt27Ei7+V6@ideak-desk.fi.intel.comReported-by:
Imre Deak <imre.deak@intel.com> Signed-off-by:
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- 27 Mar, 2023 2 commits
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Rafael J. Wysocki authored
Merge an x86_pkg_temp_thermal Intel thermal driver fix (Zhang Rui). * thermal-intel: thermal: intel: x86_pkg_temp_thermal: Add lower bound check for sysfs input
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Rafael J. Wysocki authored
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