- 26 Jun, 2023 34 commits
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Yangtao Li authored
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly print error information. Signed-off-by:
Yangtao Li <frank.li@vivo.com> Acked-by:
Keerthy <j-keerthy@ti.com> Signed-off-by:
Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230620090732.50025-8-frank.li@vivo.com
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Yangtao Li authored
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly print error information. Signed-off-by:
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Yangtao Li authored
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly print error information. Signed-off-by:
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Yangtao Li authored
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly print error information. Signed-off-by:
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Yangtao Li authored
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly print error information. Signed-off-by:
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Yangtao Li authored
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly print error information. Signed-off-by:
Martin Blumenstingl <martin.blumenstingl@googlemail.com> Signed-off-by:
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Yangtao Li authored
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly print error information. Signed-off-by:
Jernej Skrabec <jernej.skrabec@gmail.com> Signed-off-by:
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Yangtao Li authored
Ensure that all error handling branches print error information. In this way, when this function fails, the upper-layer functions can directly return an error code without missing debugging information. Otherwise, the error message will be printed redundantly or missing. Signed-off-by:
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Uwe Kleine-König authored
The .remove() callback for a platform driver returns an int which makes many driver authors wrongly assume it's possible to do error handling by returning an error code. However the value returned is (mostly) ignored and this typically results in resource leaks. To improve here there is a quest to make the remove callback return void. In the first step of this quest all drivers are converted to .remove_new() which already returns void. st_thermal_unregister() always returned zero, so convert it to return void without any loss and then just drop the return from st_mmap_remove(). Signed-off-by:
Uwe Kleine-König <u.kleine-koenig@pengutronix.de> Signed-off-by:
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Daniel Lezcano authored
The thermal framework is migrating to the generic trip points. The set of changes also implies a self-encapsulation of the thermal zone device structure where the internals are no longer directly accessible but with accessors. Use the new API instead, so the next changes can be pushed in the thermal framework without this driver failing to compile. No functional changes intended. Cc: Sandipan Patra <spatra@nvidia.com> Cc: Gal Pressman <gal@nvidia.com> Cc: Saeed Mahameed <saeedm@nvidia.com> Cc: Jakub Kicinski <kuba@kernel.org> Signed-off-by:
Simon Horman <simon.horman@corigine.com> Link: https://lore.kernel.org/r/20230525140135.3589917-2-daniel.lezcano@linaro.org
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Alex Leibovich authored
Add support for the AP807 die thermal data. This is the same as AP806, except for the coefficients. ap807 values taken from TSENSE_ADC_16FFC spec, which says: T(in Celsius) = T(code)*TSENE_GAIN+TSENE_OFFSET where in default: TSENE_OFFSET = 128.9 TSENE_GAIN = 0.394 Signed-off-by:
Alex Leibovich <alexl@marvell.com> Tested-by:
sa_ip-sw-jenkins <sa_ip-sw-jenkins@marvell.com> Reviewed-by:
Stefan Chulski <stefanc@marvell.com> Signed-off-by:
Russell King (Oracle) <rmk+kernel@armlinux.org.uk> Reviewed-by:
Miquel Raynal <miquel.raynal@bootlin.com> Signed-off-by:
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Alex Leibovich authored
Add marvell,armada-ap807-thermal compatible for the AP807 die. Signed-off-by:
Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by:
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Peng Fan authored
i.MX93 use TMU version 2.1, which supports: - TRITSR_TP5(When this field is 1, you must add 0.5 K to the temperature that TEMP reports. For example, if TEMP is 300 K and TP5=1, then the final temperature is 300.5 K.) - Has 16 TTRCR register: Temperature Range Control (TTRCR0 - TTRCR15) This patch is to add this support. Signed-off-by:
Peng Fan <peng.fan@nxp.com> Signed-off-by:
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Peng Fan authored
There are MAX 16 sensors, but not all of them supported. Such as i.MX8MQ, there are only 3 sensors. Enabling all 16 sensors will touch reserved bits from i.MX8MQ reference mannual, and TMU will stuck, temperature will not update anymore. Fixes: 45038e03 ("thermal: qoriq: Enable all sensors before registering them") Signed-off-by:
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Pankit Garg authored
No need to program site adjustment register, as programming these registers do not give accurate value and also these registers are not mentioned in Reference Manual. Signed-off-by:
Pankit Garg <pankit.garg@nxp.com> Signed-off-by:
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Chen-Yu Tsai authored
Register thermal zones as hwmon sensors to let userspace read temperatures using standard hwmon interface. Signed-off-by:
Chen-Yu Tsai <wenst@chromium.org> Signed-off-by:
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Christophe JAILLET authored
Should an error occur after calling sun8i_ths_resource_init() in the probe function, some resources need to be released, as already done in the .remove() function. Switch to the devm_clk_get_enabled() helper and add a new devm_action to turn sun8i_ths_resource_init() into a fully managed function. Move the place where reset_control_deassert() is called so that the recommended order of reset release/clock enable steps is kept. A64 manual states that: 3.3.6.4. Gating and reset Make sure that the reset signal has been released before the release of module clock gating; This fixes the issue and removes some LoC at the same time. Fixes: dccc5c3b ("thermal/drivers/sun8i: Add thermal driver for H6/H5/H3/A64/A83T/R40") Signed-off-by:
Christophe JAILLET <christophe.jaillet@wanadoo.fr> Acked-by:
Maxime Ripard <maxime@cerno.tech> Signed-off-by:
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Ricardo Cañuelo authored
This reverts commit f05c7b7d. That change was causing a regression in the generic-adc-thermal-probed bootrr test as reported in the kernelci-results list [1]. A proper rework will take longer, so revert it for now. [1] https://groups.io/g/kernelci-results/message/42660 Fixes: f05c7b7d ("thermal/drivers/mediatek: Use devm_of_iomap to avoid resource leak in mtk_thermal_probe") Signed-off-by:
Ricardo Cañuelo <ricardo.canuelo@collabora.com> Suggested-by:
AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> Reviewed-by:
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Stephan Gerhold authored
The MSM8909 SoC has 5 thermal sensors in a TSENS v0.1 block. Like MDM9607 it uses a non-standard default slope value of 3000 [1] and needs per-sensor "correction factors" to workaround issues with the factory calibration [2]. [1]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/blob/LA.UM.7.7.c26-09100-8x09.0/arch/arm/boot/dts/qcom/msm8909.dtsi#L476 [2]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/commit/6df022c6d0c2c1b4a5a6c2124dba4d57910c0911Reviewed-by:
Konrad Dybcio <konrad.dybcio@linaro.org> Reviewed-by:
Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Signed-off-by:
Stephan Gerhold <stephan.gerhold@kernkonzept.com> Signed-off-by:
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Stephan Gerhold authored
MSM8909 uses the TSENS v0.1 block similar to other SoCs like MDM9607. Document the "qcom,msm8909-tsens" compatible in the existing schema. Acked-by:
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Stephan Gerhold authored
Since the SoC compatibles must be followed by the IP version compatible (e.g. compatible = "qcom,msm8916-tsens", "qcom,tsens-v0_1";) it is redundant to list all the SoC compatibles again in the if statement. It will already match the IP-version compatible. The list has already become inconsistent since for example "qcom,msm8939-tsens" is covered by the if statement but is not listed there explicitly like the other SoCs. Simplify this by dropping the redundant SoC compatibles. ipq8064 and msm8960 are still needed because they do not have an IP-version compatible. Reviewed-by:
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Stephan Gerhold authored
According to the msm-3.18 vendor kernel from Qualcomm, mdm9607 needs "correction factors" to adjust for additional offsets observed after the factory calibration values in the fuses [1, 2]. The fixed offsets should be applied unless there is a special calibration mode value that indicates that no offsets are needed [3]. Note that the new calibration mode values are called differently in this patch compared to the vendor kernel: - TSENS_TWO_POINT_CALIB_N_WA -> ONE_PT_CALIB2_NO_OFFSET - TSENS_TWO_POINT_CALIB_N_OFFSET_WA -> TWO_PT_CALIB_NO_OFFSET This is because close inspection of the calibration function [3] reveals that TSENS_TWO_POINT_CALIB_N_WA is actually a "one point" calibration because the if statements skip all "point2" related code for it. [1]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/commit/d9d2db1b82bf3f72f5de0803d55e6849eb5b671e [2]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/commit/d75aef53a760e8ff7bac54049d00c8b2ee1b193e [3]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/blob/LE.UM.4.3.2.r1-04200-9x07/drivers/thermal/msm-tsens.c#L2987-3136 Fixes: a2149ab8 ("thermal/drivers/qcom/tsens-v0_1: Add support for MDM9607") Reviewed-by:
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Stephan Gerhold authored
According to the msm-3.18 vendor kernel from Qualcomm [1], mdm9607 uses a non-standard slope value of 3000 (instead of 3200) for all sensors. Fill it properly similar to the 8939 code added recently. [1]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/blob/LE.UM.4.3.2.r1-04200-9x07/arch/arm/boot/dts/qcom/mdm9607.dtsi#L875 Fixes: a2149ab8 ("thermal/drivers/qcom/tsens-v0_1: Add support for MDM9607") Reviewed-by:
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Stephan Gerhold authored
The old single-cell parsing code was removed for MSM8939, MDM9607 and MSM8976 but for some reason the structs defining the bit positions etc were kept around (unused). Drop them now. Cc: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Fixes: 51d78b8b ("thermal/drivers/tsens: Drop single-cell code for mdm9607") Fixes: dfadb459 ("thermal/drivers/tsens: Drop single-cell code for msm8939") Fixes: 3a908971 ("thermal/drivers/tsens: Drop single-cell code for msm8976/msm8956") Reviewed-by:
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Praveenkumar I authored
Qualcomm IPQ9574 has tsens v2.3.1 block, which is similar to IPQ8074 tsens. Reviewed-by:
Praveenkumar I <quic_ipkumar@quicinc.com> Signed-off-by:
Varadarajan Narayanan <quic_varada@quicinc.com> Signed-off-by:
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Stefan Wahren authored
Convert the DT binding document for bcm2835-thermal from .txt to YAML. Signed-off-by:
Stefan Wahren <stefan.wahren@i2se.com> Reviewed-by:
Rob Herring <robh@kernel.org> Signed-off-by:
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Thierry Reding authored
For many setups the bang-bang governor is exactly what we want. Many ARM SoC-based devices use fans to cool down the entire SoC and that works well only with the bang-bang governor because it uses the hysteresis in order to let the fan run for a while to cool the SoC down below the trip point before switching it off again. The step-wise governor will behave strangely in these situations. It doesn't use the hysteresis, so it can lead to situations where the fan is turned on for only a very brief period and then is switched back off, only to get switched back on again very quickly because the SoC hasn't cooled down very much. Signed-off-by:
Thierry Reding <treding@nvidia.com> Link: https://lore.kernel.org/r/20230609124408.3788680-1-thierry.reding@gmail.comSigned-off-by:
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Matti Lehtimäki authored
The MSM8226 TSENS IP has 6 thermal sensors in a TSENS v0.1 block. The thermal sensors use non-standard slope values. Signed-off-by:
Matti Lehtimäki <matti.lehtimaki@gmail.com> Reviewed-by:
Luca Weiss <luca@z3ntu.xyz> Signed-off-by:
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Matti Lehtimäki authored
Qualcomm MSM8226 has tsens v0.1 block. Signed-off-by:
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Wolfram Sang authored
The registers are differently named and at different offsets, but their functionality is the same as for Gen3. Signed-off-by:
Wolfram Sang <wsa+renesas@sang-engineering.com> Reviewed-by:
Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by:
Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com> Tested-by:
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Wolfram Sang authored
Gen4 will be very different, so refactor Gen3 access into separate call first. Signed-off-by:
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Wolfram Sang authored
More items to describe the TSCs are needed soon, so encapsulate the current 'ths_tj_1' item into a struct. Signed-off-by:
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Konrad Dybcio authored
The Qualcomm SM6375 platform has two instances of the tsens v2.8.0 block, add a compatible for these instances. Acked-by:
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Konrad Dybcio authored
Add the TSENS v2.x controller found on QCM2290. Acked-by:
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- 15 Jun, 2023 1 commit
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Hans de Goede authored
Since commit 955fb871 ("thermal/intel/intel_soc_dts_iosf: Use Intel TCC library") intel_soc_dts_iosf is reporting the wrong temperature. The driver expects tj_max to be in milli-degrees-celcius but after the switch to the TCC library this is now in degrees celcius so instead of e.g. 90000 it is set to 90 causing a temperature 45 degrees below tj_max to be reported as -44910 milli-degrees instead of as 45000 milli-degrees. Fix this by adding back the lost factor of 1000. Fixes: 955fb871 ("thermal/intel/intel_soc_dts_iosf: Use Intel TCC library") Reported-by:
Bernhard Krug <b.krug@elektronenpumpe.de> Signed-off-by:
Hans de Goede <hdegoede@redhat.com> Acked-by:
Zhang Rui <rui.zhang@intel.com> Cc: 6.3+ <stable@vger.kernel.org> # 6.3+ Signed-off-by:
Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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- 11 Jun, 2023 3 commits
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Linus Torvalds authored
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git://git.kernel.org/pub/scm/linux/kernel/git/tip/tipLinus Torvalds authored
Pull x86 fix from Borislav Petkov: - Set up the kernel CS earlier in the boot process in case EFI boots the kernel after bypassing the decompressor and the CS descriptor used ends up being the EFI one which is not mapped in the identity page table, leading to early SEV/SNP guest communication exceptions resulting in the guest crashing * tag 'x86_urgent_for_v6.4_rc6' of git://git.kernel.org/pub/scm/linux/kernel/git/tip/tip: x86/head/64: Switch to KERNEL_CS as soon as new GDT is installed
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git://git.samba.org/ksmbdLinus Torvalds authored
Pull smb server fixes from Steve French: "Five smb3 server fixes, all also for stable: - Fix four slab out of bounds warnings: improve checks for protocol id, and for small packet length, and for create context parsing, and for negotiate context parsing - Fix for incorrect dereferencing POSIX ACLs" * tag '6.4-rc5-smb3-server-fixes' of git://git.samba.org/ksmbd: ksmbd: validate smb request protocol id ksmbd: check the validation of pdu_size in ksmbd_conn_handler_loop ksmbd: fix posix_acls and acls dereferencing possible ERR_PTR() ksmbd: fix out-of-bound read in parse_lease_state() ksmbd: fix out-of-bound read in deassemble_neg_contexts()
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- 10 Jun, 2023 2 commits
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git://git.kernel.org/pub/scm/linux/kernel/git/wsa/linuxLinus Torvalds authored
Pull i2c fixes from Wolfram Sang: "Biggest news is that Andi Shyti steps in for maintaining the controller drivers. Thank you very much! Other than that, one new driver maintainer and the rest is usual driver bugfixes. at24 has a Kconfig dependecy fix" * tag 'i2c-for-6.4-rc6' of git://git.kernel.org/pub/scm/linux/kernel/git/wsa/linux: MAINTAINERS: Add entries for Renesas RZ/V2M I2C driver eeprom: at24: also select REGMAP i2c: sprd: Delete i2c adapter in .remove's error path i2c: mv64xxx: Fix reading invalid status value in atomic mode i2c: designware: fix idx_write_cnt in read loop i2c: mchp-pci1xxxx: Avoid cast to incompatible function type i2c: img-scb: Fix spelling mistake "innacurate" -> "inaccurate" MAINTAINERS: Add myself as I2C host drivers maintainer
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git://git.kernel.org/pub/scm/linux/kernel/git/vkoul/soundwireLinus Torvalds authored
Pull soundwire fixes from Vinod Koul: "Core fix for missing flag clear, error patch handling in qcom driver and BIOS quirk for HP Spectre x360: - HP Spectre x360 soundwire DMI quirk - Error path handling for qcom driver - Core fix for missing clear of alloc_slave_rt" * tag 'soundwire-6.4-fixes' of git://git.kernel.org/pub/scm/linux/kernel/git/vkoul/soundwire: soundwire: stream: Add missing clear of alloc_slave_rt soundwire: qcom: add proper error paths in qcom_swrm_startup() soundwire: dmi-quirks: add new mapping for HP Spectre x360
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