Commit 130aa61a authored by Stephen Hemminger's avatar Stephen Hemminger Committed by David S. Miller

bonding: fix multiple module load problem

Some users still load bond module multiple times to create bonding
devices.  This accidentally was broken by a later patch about
the time sysfs was fixed.  According to Jay, it was broken
by:
   commit b8a9787e
   Author: Jay Vosburgh <fubar@us.ibm.com>
   Date:   Fri Jun 13 18:12:04 2008 -0700

     bonding: Allow setting max_bonds to zero

Note: sysfs and procfs still produce WARN() messages when this is done
so the sysfs method is the recommended API.
Signed-off-by: default avatarStephen Hemminger <shemminger@vyatta.com>
Signed-off-by: default avatarJay Vosburgh <fubar@us.ibm.com>
Signed-off-by: default avatarDavid S. Miller <davem@davemloft.net>
parent 5ef12d98
...@@ -1541,6 +1541,7 @@ int bond_create_sysfs(void) ...@@ -1541,6 +1541,7 @@ int bond_create_sysfs(void)
printk(KERN_ERR printk(KERN_ERR
"network device named %s already exists in sysfs", "network device named %s already exists in sysfs",
class_attr_bonding_masters.attr.name); class_attr_bonding_masters.attr.name);
ret = 0;
} }
return ret; return ret;
......
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