arm64: dts: hi3660: Add thermal cooling management

Add nodes and properties for thermal cooling management support.
Signed-off-by: Tao Wang <jean.wangtao@linaro.org>
Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: Wei Xu <xuwei5@hisilicon.com>

arch/arm64/boot/dts/hisilicon/hi3660.dtsi

@@ -7,6 +7,7 @@
 
 #include <dt-bindings/interrupt-controller/arm-gic.h>
 #include <dt-bindings/clock/hi3660-clock.h>
+#include <dt-bindings/thermal/thermal.h>
 
 / {
 	compatible = "hisilicon,hi3660";
@@ -64,6 +65,8 @@ cpu0: cpu@0 {
 			capacity-dmips-mhz = <592>;
 			clocks = <&stub_clock HI3660_CLK_STUB_CLUSTER0>;
 			operating-points-v2 = <&cluster0_opp>;
+			#cooling-cells = <2>;
+			dynamic-power-coefficient = <110>;
 		};
 
 		cpu1: cpu@1 {
@@ -112,6 +115,8 @@ cpu4: cpu@100 {
 			capacity-dmips-mhz = <1024>;
 			clocks = <&stub_clock HI3660_CLK_STUB_CLUSTER1>;
 			operating-points-v2 = <&cluster1_opp>;
+			#cooling-cells = <2>;
+			dynamic-power-coefficient = <550>;
 		};
 
 		cpu5: cpu@101 {
@@ -1073,5 +1078,44 @@ tsensor: tsensor@fff30000 {
 			interrupts = <GIC_SPI 145 IRQ_TYPE_LEVEL_HIGH>;
 			#thermal-sensor-cells = <1>;
 		};
+
+		thermal-zones {
+
+			cls0: cls0 {
+				polling-delay = <1000>;
+				polling-delay-passive = <100>;
+				sustainable-power = <4500>;
+
+				/* sensor ID */
+				thermal-sensors = <&tsensor 1>;
+
+				trips {
+					threshold: trip-point@0 {
+						temperature = <65000>;
+						hysteresis = <1000>;
+						type = "passive";
+					};
+
+					target: trip-point@1 {
+						temperature = <75000>;
+						hysteresis = <1000>;
+						type = "passive";
+					};
+				};
+
+				cooling-maps {
+					map0 {
+						trip = <&target>;
+						contribution = <1024>;
+						cooling-device = <&cpu0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+					};
+					map1 {
+						trip = <&target>;
+						contribution = <512>;
+						cooling-device = <&cpu4 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+					};
+				};
+			};
+		};
 	};
 };