- 27 Jan, 2020 40 commits
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Pascal Paillet authored
With the STM32 thermal peripheral, it is not possible to dump the temperature that has caused the interrupt. When the temperature reaches the low threshold, we generally read a temperature that is a little bit higher than the low threshold. This maybe due to sampling precision, and also because the CPU becomes hotter when it quits WFI mode. In that case, the framework does not change the trip points. This leads to a lot of low threshold interrupts. The fix is to set the low threshold value 0.5 degrees Celsius below the actual request. The problem is not so frequent with the high threshold and it would no be a good idea to set the threshold value higher than the request. Signed-off-by:
Pascal Paillet <p.paillet@st.com> Signed-off-by:
Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200110101605.24984-7-p.paillet@st.com
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Pascal Paillet authored
Change the way of computing to avoid rounds by 1 or 2 degrees. Also simplify the sampling time management that is hard-coded to maximum value during probe. Signed-off-by:
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Pascal Paillet authored
Let the thermal framework handle the trip points instead of custom code inside the driver. This is backward compatible, simplifies the driver and offers the possibility to the user to set any trip point he needs. stm_thermal_set_trips callback that is registered to set_trips ops to handle the low and high thresholds and replaces stm_thermal_set_threshold and stm_thermal_update_threshold functions. modify irq enable to handle the thresholds. Signed-off-by:
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Pascal Paillet authored
In case of CPU reset, the interrupts could be enabled at boot time. Disable interrupts and clear flags. Signed-off-by:
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Pascal Paillet authored
Be sure get_temp returns an error while disabling or enabling the device. Set THERMAL_DEVICE_ENABLED state at the end of power on function. Set THERMAL_DEVICE_DISABLED state at the beginning of power off function. Signed-off-by:
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Pascal Paillet authored
Fix a mistake with the ICIFR register name. Signed-off-by:
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Peter Mamonov authored
When devm_thermal_zone_of_sensor_register() is called from hwmon_thermal_add_sensor() it is possible that the relevant sensor is missing an OF node. In this case thermal_zone_of_sensor_register() returns -EINVAL which causes hwmon_thermal_add_sensor() to fail as well. This patch changes relevant return code of thermal_zone_of_sensor_register() to -ENODEV, which is tolerated by hwmon_thermal_add_sensor(). Here is a particular case of such behaviour: the Marvell ethernet PHYs driver registers hwmon device for the built-in temperature sensor (see drivers/net/phy/marvell.c). Since the sensor doesn't have associated OF node devm_hwmon_device_register() returns error which ultimately causes failure of the PHY driver's probe function. Signed-off-by:
Peter Mamonov <pmamonov@gmail.com> Signed-off-by:
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Niklas Söderlund authored
The hardware manual states that the operation of the sensor is not guaranteed with temperatures above 125°C, not that the readings are invalid. Remove the bound check and try to deliver temperature readings even if we are outside the guaranteed operation range. Signed-off-by:
Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Signed-off-by:
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Niklas Söderlund authored
The hardware manual states that the operation of the sensor is not guaranteed outside the range of -45°C to 125°C, not that the readings are invalid. Remove the bound check and try to deliver temperature readings even if we are outside the guaranteed operation range. Signed-off-by:
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Gayatri Kammela authored
Add Comet Lake to the list of the platforms to support intel_pch_thermal driver. Cc: Zhang rui <rui.zhang@intel.com> Cc: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by:
Gayatri Kammela <gayatri.kammela@intel.com> Acked-by:
Zhang Rui <rui.zhang@intel.com> Signed-off-by:
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Chuhong Yuan authored
The driver calls pci_request_regions() in probe and uses pci_release_regions() in probe failure. However, it calls pci_release_region() in remove, which does match the other two calls. Use pci_release_regions() instead to unify them. Signed-off-by:
Chuhong Yuan <hslester96@gmail.com> Acked-by:
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Swaminathan, Nivedita authored
Added new PCI id for Jasper Lake processor thermal device. Signed-off-by:
Swaminathan, Nivedita <nivedita.swaminathan@intel.com> Signed-off-by:
Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Acked-by:
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Stefan Wahren authored
Drop the reg property since this only necessary for the parent and add the missing thermal-sensor-cells property description. Signed-off-by:
Stefan Wahren <stefan.wahren@i2se.com> Fixes: 37e9cc08e9678 ("dt-bindings: Add Broadcom AVS RO thermal") Reviewed-by:
Rob Herring <robh@kernel.org> Signed-off-by:
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Florian Fainelli authored
Since we do not have interrupts on BCM7216, we cannot have trip point crossing, the thermal subsystem expects us to provide a NULL set_trips operation in that case, so make it possible to provide per-process thermal_zone_of_device_ops Reviewed-by:
Amit Kucheria <amit.kucheria@linaro.org> Signed-off-by:
Florian Fainelli <f.fainelli@gmail.com> Signed-off-by:
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Florian Fainelli authored
If we are successful grabbing the interrupt resource, then register an interrupt handler, this makes it easier to support the interrupt as being optional, which is it for 7216. Reviewed-by:
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Florian Fainelli authored
Match the 7216 compatible string in order to derive the correct 16nm process thermal parameters to obtain correct readings. Reviewed-by:
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Florian Fainelli authored
BCM7216 is a 16nm process STB chip, which requires a different compatible string to differentiate different temperature formulas. Reviewed-by:
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Florian Fainelli authored
The driver is currently assuming that it is operating with a 28nm process chip, which has a specific formula to convert temperature to a code and vice versa. Update the code to support providing two key values: offset and multiplier to derive the correct formulas. Signed-off-by:
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Florian Fainelli authored
At the time the brcmstb_thermal driver and its binding were merged, the DT binding did not make the coefficients properties a mandatory one, therefore all users of the brcmstb_thermal driver out there have a non functional implementation with zero coefficients. Even if these properties were provided, the formula used for computation is incorrect. The coefficients are entirely process specific (right now, only 28nm is supported) and not board or SoC specific, it is therefore appropriate to hard code them in the driver given the compatibility string we are probed with which has to be updated whenever a new process is introduced. We remove the existing coefficients definition since subsequent patches are going to add support for a new process and will introduce new coefficients as well. Fixes: 9e03cf1b ("thermal: add brcmstb AVS TMON driver") Signed-off-by:
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Geert Uytterhoeven authored
rcar_thermal_update_temp() takes a mutex, so it is always called in a context that can sleep. Hence replace the 300 µs busy loop by a call to usleep_range(), to allow other threads to run. Signed-off-by:
Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by:
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Stefan Wahren authored
This builds the BCM2711 thermal driver as module for the Raspberry Pi 4. Signed-off-by:
Nicolas Saenz Julienne <nsaenzjulienne@suse.de> Tested-by:
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Stefan Wahren authored
This enables thermal for the BCM2711 (used on Raspberry Pi 4) by adding the AVS monitor and a subnode for the thermal part. Signed-off-by:
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Stefan Wahren authored
This adds the thermal sensor driver for the Broadcom BCM2711 SoC, which is placed on the Raspberry Pi 4. The driver only provides SoC temperature reading so far. Signed-off-by:
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Stefan Wahren authored
Since the BCM2711 doesn't have a AVS TMON block, the thermal information must be retrieved from the AVS ring oscillator block. This block is part of the AVS monitor which contains a bunch of raw sensors. Signed-off-by:
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Yangtao Li authored
Expose sun8i thermal as a HWMON device. Signed-off-by:
Yangtao Li <tiny.windzz@gmail.com> Signed-off-by:
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Yangtao Li authored
The cp_ft_flag variable is not used after initialization, so delete it. After that, THS_EFUSE_CP_FT_MASK, THS_EFUSE_CP_FT_BIT and THS_CALIBRATION_IN_FT are not needed, so delete them. Signed-off-by:
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Yangtao Li authored
sparse returns a warning: "drivers/thermal/sun8i_thermal.c:341:60: sparse: sparse: Using plain integer as NULL pointer". Fix it by replacing the zero integer by a NULL pointer. Reported-by:
kbuild test robot <lkp@intel.com> Signed-off-by:
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Yangtao Li authored
According to the spec, r40 has 2 thermal sensors. Sensor0 located in the CPU, another in the GPU. Fixes: dccc5c3b ("thermal/drivers/sun8i: Add thermal driver for H6/H5/H3/A64/A83T/R40") Signed-off-by:
Corentin Labbe <clabbe.montjoie@gmail.com> Tested-on: sun8i-r40-bananapi-m2-ultra Signed-off-by:
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Krzysztof Kozlowski authored
Fix up inconsistent usage of upper and lowercase letters in "Samsung" and "Exynos" names. "SAMSUNG" and "EXYNOS" are not abbreviations but regular trademarked names. Therefore they should be written with lowercase letters starting with capital letter. The lowercase "Exynos" name is promoted by its manufacturer Samsung Electronics Co., Ltd., in advertisement materials and on website. Although advertisement materials usually use uppercase "SAMSUNG", the lowercase version is used in all legal aspects (e.g. on Wikipedia and in privacy/legal statements on https://www.samsung.com/semiconductor/privacy-global/). Signed-off-by:
Krzysztof Kozlowski <krzk@kernel.org> Signed-off-by:
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Martin Blumenstingl authored
Since commit d36e2fa0 ("thermal: generic-adc: make lookup table optional") "generic-adc-thermal" can be used with an IIO_TEMP channel. In this case the following message is logged at probe time: no lookup table, assuming DAC channel returns milliCelcius Silence this info message if the channel type is known to be in milli celsius. Keep this message when the channel type is unknown or not of type temperature. Signed-off-by:
Martin Blumenstingl <martin.blumenstingl@googlemail.com> Signed-off-by:
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Martin Blumenstingl authored
A "generic-adc-thermal" without "temperature-lookup-table" is perfectly valid since commit d36e2fa0 ("thermal: generic-adc: make lookup table optional"). On deferred probe the message "no lookup table, assuming DAC channel returns milliCelcius" is still logged. Prevent this message on deferred probe of the IIO channel by first looking up the IIO channel. Signed-off-by:
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Yangtao Li authored
sun8i-thermal driver supports thermal sensor in wide range of Allwinner SoCs. Add YAML schema for its bindings. Signed-off-by:
Vasily Khoruzhick <anarsoul@gmail.com> Acked-by:
Maxime Ripard <mripard@kernel.org> Signed-off-by:
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Yangtao Li authored
This patch adds the support for allwinner thermal sensor, within allwinner SoC. It will register sensors for thermal framework and use device tree to bind cooling device. Signed-off-by:
Ondrej Jirman <megous@megous.com> Signed-off-by:
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Daniel Lezcano authored
The function of_thermal_free_zone() is only used the initialization function which all belonging to the init section. Move it also to the __init section. Signed-off-by:
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Daniel Lezcano authored
The function of_thermal_destroy_zones() is only used internally by the of_parse_thermal_zones() for rollbacking in case of error. Make it static and tag it as an __init function. Signed-off-by:
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Daniel Lezcano authored
As we introduced the idle injection cooling device called cpuidle_cooling, let's be consistent and rename the cpu_cooling to cpufreq_cooling as this one mitigates with OPPs changes. Signed-off-by:
Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by:
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Daniel Lezcano authored
The cpu idle cooling device offers a new method to cool down a CPU by injecting idle cycles at runtime. It has some similarities with the intel power clamp driver but it is actually designed to be more generic and relying on the idle injection powercap framework. The idle injection duration is fixed while the running duration is variable. That allows to have control on the device reactivity for the user experience. An idle state powering down the CPU or the cluster will allow to drop the static leakage, thus restoring the heat capacity of the SoC. It can be set with a trip point between the hot and the critical points, giving the opportunity to prevent a hard reset of the system when the cpufreq cooling fails to cool down the CPU. With more sophisticated boards having a per core sensor, the idle cooling device allows to cool down a single core without throttling the compute capacity of several cpus belonging to the same clock line, so it could be used in collaboration with the cpufreq cooling device. Signed-off-by:
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Daniel Lezcano authored
Provide some documentation for the idle injection cooling effect in order to let people to understand the rational of the approach for the idle injection CPU cooling device. Signed-off-by:
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Stefan Schaeckeler authored
By default, of-based thermal drivers do not enable hwmon. Explicitly enable hwmon for both, the soc and gpu temperature sensor. Signed-off-by:
Stefan Schaeckeler <schaecsn@gmx.net> Tested-by:
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Zak Hays authored
The reset bit needs to be cleared in the init sequence otherwise it holds the block in reset. Signed-off-by:
Zachary Hays <zhays@lexmark.com> Reviewed-by:
Miquel Raynal <miquel.raynal@bootlin.com> Signed-off-by:
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