Merge tag 'renesas-arm64-dt2-for-v4.19' of https://git.kernel.org/pub/scm/linux/kernel/git/horms/renesas into next/dt

Second Round of Renesas ARM64 Based SoC DT Updates for v4.19

Corrections:

* Remove non-existing STBE region from Ether-AVB node in DT of
  R-Car E3 (r8a77990) SoC

Cleanups:

* Consistently use rwdt as label for Renesas Watchdog Timer devices
* Add second port to rcar_sound placeholder in DT of R-Car M3-N (r8a77965) SoC
* Fix adv7482 decimal unit addresses in DT of Salvator-X and -XS boards

Enhancements:

* Describe in DT:
  - INTC-EX of R-Car V3H (r8a77980) SoC
  - USB3.0 of R-Car E3 (r8a77980) SoC
  - All SCIF and HSCIF devices of R-Car D3 (r8a77995) SoC.
    Previously only SCIF2, used as the debug consile, was described.
  - All IPMMU devicesof R-Car M3-N (r8a77965), V3H (r8a77980) and
    E3 (r8a77990) SoCs
* Enable USB3.0 in DT of R-Car E3 (r8a77980) based Ebisu board
* Prefer HSCIF1 over SCIF1 in DT of Salvator-X and -XS boards

* tag 'renesas-arm64-dt2-for-v4.19' of https://git.kernel.org/pub/scm/linux/kernel/git/horms/renesas:
  arm64: dts: renesas: r8a77980: add INTC-EX support
  arm64: dts: renesas: r8a77990: Enable USB3.0 host for Ebisu board
  arm64: dts: renesas: r8a77995: Add SCIF {0,1,3,4,5} and all HSCIF device nodes
  arm64: dts: renesas: r8a779{65,80,90}: Add IPMMU devices nodes
  arm64: dts: renesas: Unify the labels for RWDT
  arm64: dts: renesas: salvator-common: Prefer HSCIF1 over SCIF1
  arm64: dts: renesas: r8a77965: Add second port to rcar_sound placeholder
  arm64: dts: renesas: salvator-common: Fix adv7482 decimal unit addresses
  arm64: dts: renesas: r8a77990: Remove non-existing STBE region
Signed-off-by: Olof Johansson <olof@lixom.net>

Merge tag 'at91-ab-4.19-dt' of git://git.kernel.org/pub/scm/linux/kernel/git/abelloni/linux into next/dt

AT91 DT for 4.19:

 - New boards from Laird: WB45N, WB50N, SOM60 modules and DVK, Gatwick
 - fix the PMC compatibles

* tag 'at91-ab-4.19-dt' of git://git.kernel.org/pub/scm/linux/kernel/git/abelloni/linux:
  ARM: dts: at91: fix typos for SSC TD functions
  ARM: dts: add support for Laird SOM60 module and DVK boards
  ARM: dts: add support for Gatwick board based on WB50N
  ARM: dts: add support for Laird WB50N cpu module and DVK
  ARM: dts: add support for Laird WB45N cpu module and DVK
  ARM: dts: at91: add labels to soc dtsi for derivative boards
  dt-bindings: add laird and giantec vendor prefix
  ARM: dts: fix PMC compatible
  ARM: at91: fix USB clock detection handling
  dt-bindings: clk: at91: Document all the PMC compatibles
  dt-bindings: arm: remove PMC bindings
Signed-off-by: Olof Johansson <olof@lixom.net>

The OPP properties, like "operating-points", should either be present
for all the CPUs of a cluster or none. If these are present only for a
subset of CPUs of a cluster then things will start falling apart as soon
as the CPUs are brought online in a different order. For example, this
will happen because the operating system looks for such properties in
the CPU node it is trying to bring up, so that it can create an OPP
table.

Add such missing properties.

Fix other missing properties (clocks, clock latency) as well to
make it all work.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Jisheng Zhang <Jisheng.Zhang@synaptics.com>
Signed-off-by: Olof Johansson <olof@lixom.net>

ARM64: DT: Hisilicon SoC DT updates for 4.19v2

- Tidy up MMC properties for hi3660
- Remove keep-power-in-suspend on hikey and hikey960 to
  avoid keeping wifi power during suspend and let the
  user enable it if required
- Update idle states for hikey960
- Add missing cooling device properties for cpus on hi6220

* tag 'hisi-arm64-dt-for-4.19v2' of git://github.com/hisilicon/linux-hisi:
  arm64: dts: hisilicon: Add missing cooling device properties for CPUs
  arm64: hikey960: update idle-states
  arm64: dts: hikey: Remove keep-power-in-suspend property
  arm64: dts: hikey960: Remove keep-power-in-suspend property
  arm64: dts: hikey960: Clean up MMC properties and move to proper file
  arm64: dts: hikey960: Remove deprecated MMC properties
Signed-off-by: Olof Johansson <olof@lixom.net>

ARM: dts: zynq: DT changes for v4.19

- Add Z-turn board
- Add mmc aliases
- Fix model information
- Sort out documentatio
- Update Zybo Z7
- Fix gpio-keys

* tag 'zynq-dt-for-v4.19-v2' of https://github.com/Xilinx/linux-xlnx:
  ARM: dts: zynq: Remove #address/#size-cells from gpio-keys
  ARM: dts: zynq: Add LEDs to the Zybo Z7 board
  ARM: dts: zynq: Use gpio constants for the Zybo Z7 board
  ARM: dts: zynq: Fix memory size on the Zybo Z7 board
  dt-bindings: xilinx: zynq: Add missing boards
  dt-bindings: xilinx: zynq: Move Paralella board to Xilinx
  dt-bindings: xilinx: zynq: Sort entries alphabetically
  dt-bindings: xilinx: zynq: Improve boards description
  ARM: dts: zynq: correct and improve the model property of dt files
  ARM: dts: zynq: Set correct manufacturer for ZedBoard and MicroZed boards
  ARM: dts: zynq: Add mmc alias for zc702/zc706/zed/zybo
  ARM: dts: zynq: Add support for Z-turn board
Signed-off-by: Olof Johansson <olof@lixom.net>

arm: dts: zynqmp: DT changes for v4.19

- Use serdev for BT in zcu100
- Remove ep108
- Fix gpio-keys binding
- Add suport for Ultra96

* tag 'zynqmp-dt-for-v4.19-v2' of https://github.com/Xilinx/linux-xlnx:
  arm64: dts: zynqmp: Add support for Avnet Ultra96 rev1 board
  arm64: dts: zynqmp: Remove #address/#size-cells from gpio-keys
  arm64: dts: zynqmp: Remove ep108 board
  arm64: dts: zynqmp: Use serdev for zcu100 BT
Signed-off-by: Olof Johansson <olof@lixom.net>

Merge tag 'uniphier-dt64-v4.19' of git://git.kernel.org/pub/scm/linux/kernel/git/masahiroy/linux-uniphier into next/dt

UniPhier ARM64 SoC DT updates for v4.19

- Add missing #cooling-cells properties

- Add hp-det-gpio property to detect headphone via GPIO

* tag 'uniphier-dt64-v4.19' of git://git.kernel.org/pub/scm/linux/kernel/git/masahiroy/linux-uniphier:
  arm64: dts: uniphier: add headphone detect gpio for LD11 global board
  arm64: dts: uniphier: add headphone detect gpio for LD20 global board
  arm64: dts: uniphier: Add missing cooling device properties for CPUs
Signed-off-by: Olof Johansson <olof@lixom.net>

Merge tag 'uniphier-dt-v4.19' of git://git.kernel.org/pub/scm/linux/kernel/git/masahiroy/linux-uniphier into next/dt

UniPhier ARM SoC DT updates for v4.19

- Add missing #cooling-cells properties

* tag 'uniphier-dt-v4.19' of git://git.kernel.org/pub/scm/linux/kernel/git/masahiroy/linux-uniphier:
  ARM: dts: uniphier: Add missing cooling device properties for CPUs
Signed-off-by: Olof Johansson <olof@lixom.net>

Merge tag 'omap-for-v4.19/dt-pt2-signed' of git://git.kernel.org/pub/scm/linux/kernel/git/tmlind/linux-omap into next/dt

Few more beaglebone variants for v4.19 merge window

This adds dts files for two new beaglebone variants for
Octavo Systems OSD3358-SM-RED and Sancloud am335x-sancloud-bbe.

* tag 'omap-for-v4.19/dt-pt2-signed' of git://git.kernel.org/pub/scm/linux/kernel/git/tmlind/linux-omap:
  ARM: dts: am335x: add am335x-sancloud-bbe board support
  dt-bindings: Add vendor prefix for Sancloud
  ARM: dts: Add DT support for Octavo Systems OSD3358-SM-RED based on TI AM335x
Signed-off-by: Olof Johansson <olof@lixom.net>

Describe the INTC-EX interrupt controller in the R8A77980 device tree.

Based on the original (and large) patch by Vladimir Barinov.
Signed-off-by: Vladimir Barinov <vladimir.barinov@cogentembedded.com>
Signed-off-by: Sergei Shtylyov <sergei.shtylyov@cogentembedded.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

This patch adds and USB3.0 host device node and enable it for
R-Car E3 Ebisu board.
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>

This patch adds the device nodes for SCIF {0,1,3,4,5} and all HSCIF serial
ports, incl. clocks, power domain and DMAs.
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Ulrich Hecht <ulrich.hecht+renesas@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>

Fix typo for TD function of pins PIN_PB22 and PIN_PC14
Signed-off-by: Claudiu Beznea <claudiu.beznea@microchip.com>
Signed-off-by: Alexandre Belloni <alexandre.belloni@bootlin.com>

This adds support for Lairds upcoming SOM module, featuring Marvell WiFi
and Bluetooth, 2Gb NAND / 1Gb LPDDR SDRAM, and an Atmel SAMA5D3 CPU.
Signed-off-by: Ben Whitten <ben.whitten@lairdtech.com>
Signed-off-by: Alexandre Belloni <alexandre.belloni@bootlin.com>

Add support for the LoRa gateway from Laird, the RG1xx.
This board houses the WB50NBT CPU module along with a Semtech SX1301 based
concentrator card.
https://www.lairdtech.com/products/rg1xx-lora-gatewaySigned-off-by: Ben Whitten <ben.whitten@lairdtech.com>
Signed-off-by: Alexandre Belloni <alexandre.belloni@bootlin.com>

This adds support for Lairds CPU module, featuring Atheros wifi, CSR
Bluetooth and, Atmel SAMA5D3 CPU.
https://www.lairdtech.com/products/wb50nbt-wi-fi-bluetooth-moduleSigned-off-by: Ben Whitten <ben.whitten@lairdtech.com>
Signed-off-by: Alexandre Belloni <alexandre.belloni@bootlin.com>

This adds support for Lairds combo CPU module, featuring on board
Atheros wifi, CSR Bluetooth radio and, Atmel CPU.
https://www.lairdtech.com/products/wb45nbtSigned-off-by: Ben Whitten <ben.whitten@lairdtech.com>
Signed-off-by: Alexandre Belloni <alexandre.belloni@bootlin.com>

This adds labels to commonly used device-tree nodes so that derivative
boards can avoid ahb/apb hierarchy.
Signed-off-by: Ben Whitten <ben.whitten@lairdtech.com>
Signed-off-by: Alexandre Belloni <alexandre.belloni@bootlin.com>

dts reports incorrect usage of these properties in gpio-keys node.
Warning (avoid_unnecessary_addr_size): /gpio-keys: unnecessary

The patch is removing these useless properties.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>

Add an LED node, connected to the Processing System (PS)
Signed-off-by: Luis Araneda <luaraneda@gmail.com>
Signed-off-by: Michal Simek <michal.simek@xilinx.com>

Include GPIO dt-bindings and use GPIO_ACTIVE_* constants
to improve readability
Signed-off-by: Luis Araneda <luaraneda@gmail.com>
Signed-off-by: Michal Simek <michal.simek@xilinx.com>

According to the reference manual, the board has two Micron
MT41K256M16HA-125 DDR3L memory ICs, which have 512 MiB each

Tested on a ZYBO-Z7-20 board
Signed-off-by: Luis Araneda <luaraneda@gmail.com>
Signed-off-by: Michal Simek <michal.simek@xilinx.com>

The bindings were missing when the device-tree
files were added
Signed-off-by: Luis Araneda <luaraneda@gmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Michal Simek <michal.simek@xilinx.com>

Move the Adapteva Parallela board to Xilinx dt-bindings,
as it's based on a Zynq SoC from Xilinx
Signed-off-by: Luis Araneda <luaraneda@gmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Michal Simek <michal.simek@xilinx.com>

Sort additional compatible strings (boards) alphabetically
by their manufacturer and model number

This will help when finding a board because they
will be grouped by their manufacturer
Signed-off-by: Luis Araneda <luaraneda@gmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Michal Simek <michal.simek@xilinx.com>

Change the description of some boards to make it similar
to the value of the model property from their respective
device-tree, using the format "<manufacturer> <model>"
Signed-off-by: Luis Araneda <luaraneda@gmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Michal Simek <michal.simek@xilinx.com>

Replace the current value of the model property by a more accurate
description of each board (which includes the manufacturer), as some
of the boards had the same value ("Xilinx Zynq")
Signed-off-by: Luis Araneda <luaraneda@gmail.com>
Signed-off-by: Michal Simek <michal.simek@xilinx.com>

Both boards are made by Avnet, Inc. So add an additional
value to the compatible property
Signed-off-by: Luis Araneda <luaraneda@gmail.com>
Signed-off-by: Michal Simek <michal.simek@xilinx.com>

Add missing mmc alias.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>

Add a dts for MYIR Z-turn board and respective target in Makefile.
Signed-off-by: Anton Gerasimov <tossel@gmail.com>
Signed-off-by: Michal Simek <michal.simek@xilinx.com>

Avnet Ultra96 rev1 board is commercialized Xilinx zcu100 revC/D
internal board. The patch is reusing zcu100 revC files but changing
model description and compatible strings which are used for example by
libmraa.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>

dts reports incorrect usage of these properties in gpio-keys node.
Warning (avoid_unnecessary_addr_size): /gpio-keys: unnecessary

The patch is removing these useless properties.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>

ZynqMP Emulation board is no longer tested and there is no reason to
keep maintaining it.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>

Mainline started to use serdev interface for uart attached devices.
Change description to reflect it.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>

This patch adds GPIO for headphone detection on LD11 global board.
Signed-off-by: Katsuhiro Suzuki <suzuki.katsuhiro@socionext.com>
Signed-off-by: Masahiro Yamada <yamada.masahiro@socionext.com>

This patch adds GPIO for headphone detection on LD20 global board.
Signed-off-by: Katsuhiro Suzuki <suzuki.katsuhiro@socionext.com>
Signed-off-by: Masahiro Yamada <yamada.masahiro@socionext.com>

The cooling device properties, like "#cooling-cells" and
"dynamic-power-coefficient", should either be present for all the CPUs
of a cluster or none. If these are present only for a subset of CPUs of
a cluster then things will start falling apart as soon as the CPUs are
brought online in a different order. For example, this will happen
because the operating system looks for such properties in the CPU node
it is trying to bring up, so that it can register a cooling device.

Add such missing properties.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Masahiro Yamada <yamada.masahiro@socionext.com>

The cooling device properties, like "#cooling-cells" and
"dynamic-power-coefficient", should either be present for all the CPUs
of a cluster or none. If these are present only for a subset of CPUs of
a cluster then things will start falling apart as soon as the CPUs are
brought online in a different order. For example, this will happen
because the operating system looks for such properties in the CPU node
it is trying to bring up, so that it can register a cooling device.

Add such missing properties.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Masahiro Yamada <yamada.masahiro@socionext.com>

The cooling device properties, like "#cooling-cells" and
"dynamic-power-coefficient", should either be present for all the CPUs
of a cluster or none. If these are present only for a subset of CPUs of
a cluster then things will start falling apart as soon as the CPUs are
brought online in a different order. For example, this will happen
because the operating system looks for such properties in the CPU node
it is trying to bring up, so that it can register a cooling device.

Add such missing properties.

Do minor rearrangement as well to keep ordering consistent.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Wei Xu <xuwei5@hisilicon.com>

Update entry/exit latency and residency time of hikey960 to use more
realistic figures based on unitary tests done on the platform.

The complete results (in us) :
                  big cluster
                  cluster  CPU
max entry latency     800  400
max exit latency     2900  550
residency  903Mhz    5000 1500
residency 2363Mhz       0 1500

                  little cluster
                  cluster  CPU
max entry latency     500  400
max exit latency     1600  650
residency  533Mhz    8000 4500
residency 1844Mhz       0 1500

We can see that the residency time depends of the running OPP which is not
handled for now. Then we also have to take into account the constraint of
a residency time shorter than the tick to get full advantage of idle loop
reordering(tick is stopped if idle duration is higher than tick period).
Finally the selected residency value are :
                 big cluster
                  cluster  CPU
residency            3700 1500

                  little cluster
                  cluster  CPU
residency            3500 1500

A simple test with a task waking up every 11.111ms shows improvement:
- 5% a lowest OPP
- 22% at highest OPP

The period has been chosen:
- to be shorter than old cluster residency time and longer than new
residency time of cluster off C-state
- to prevent any sync with tick (4ms) when running tests that can add
some variances between tests
Signed-off-by: Vincent Guittot <vincent.guittot@linaro.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: Wei Xu <xuwei5@hisilicon.com>