- 14 Dec, 2022 22 commits
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Luca Weiss authored
On gen2 chips the stage2 threshold is not 140 degC but 125 degC. Make the warning message clearer by using this variable and also by including the temperature that was checked for. Fixes: aa92b331 ("thermal/drivers/qcom-spmi-temp-alarm: Add support for GEN2 rev 1 PMIC peripherals") Signed-off-by: Luca Weiss <luca.weiss@fairphone.com> Reviewed-by: Amit Kucheria <amitk@kernel.org> Link: https://lore.kernel.org/r/20221020145237.942146-1-luca.weiss@fairphone.comSigned-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
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Krzysztof Kozlowski authored
Narrow number of interrupts per variants: SC8280XP, SM6350 and SM8450. The compatibles are already used and described. They only missed the constraints of number of interrupts. Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20221116113140.69587-1-krzysztof.kozlowski@linaro.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
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Christophe JAILLET authored
This file does not use rcu, so there is no point in including <linux/rculist.h>. Remove it. Signed-off-by: Christophe JAILLET <christophe.jaillet@wanadoo.fr> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Link: https://lore.kernel.org/r/9adeec47cb5a8193016272d5c8bf936235c1711d.1669459337.git.christophe.jaillet@wanadoo.frSigned-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
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Alexander Stein authored
Expose thermal sensors as HWMON devices. Signed-off-by: Alexander Stein <alexander.stein@ew.tq-group.com> Link: https://lore.kernel.org/r/20220726122331.323093-1-alexander.stein@ew.tq-group.comSigned-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
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Johan Hovold authored
Drivers should not be logging errors on probe deferral. Switch to using dev_err_probe() to log failures when parsing the devicetree to avoid errors like: qcom-spmi-adc-tm5 c440000.spmi:pmic@0:adc-tm@3400: get dt data failed: -517 when a channel is not yet available. Signed-off-by: Johan Hovold <johan+linaro@kernel.org> Reviewed-by: Manivannan Sadhasivam <mani@kernel.org> Reviewed-by: Andrew Halaney <ahalaney@redhat.com> Link: https://lore.kernel.org/r/20221102152630.696-1-johan+linaro@kernel.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
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Daniel Golle authored
Document compatible string 'mediatek,mt7986-thermal' for V3 thermal unit found in MT7986 SoCs. 'mediatek,mt7981-thermal' is also added as it is identical with the thermal unit of MT7986. Signed-off-by: Daniel Golle <daniel@makrotopia.org> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
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Geert Uytterhoeven authored
It does not make sense to have a comma after a sentinel, as any new elements must be added before the sentinel. Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be> Acked-by: Keerthy <j-keerthy@ti.com> Link: https://lore.kernel.org/r/1d6de2a80b919cb11199e56ac06ad21c273ebe57.1669045586.git.geert+renesas@glider.beSigned-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
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Marek Vasut authored
The TMU TASR, TCALIVn, TRIM registers must be explicitly programmed with calibration values in OCOTP. Add support for reading the OCOTP calibration data and programming those into the TMU hardware. The MX8MM/MX8MN TMUv1 uses only one OCOTP cell, while MX8MP TMUv2 uses 4, the programming differs in each case. Based on U-Boot commits: 70487ff386c ("imx8mm: Load fuse for TMU TCALIV and TASR") ebb9aab318b ("imx: load calibration parameters from fuse for i.MX8MP") Reviewed-by: Peng Fan <peng.fan@nxp.com> Signed-off-by: Marek Vasut <marex@denx.de> Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
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Marek Vasut authored
The TMU TASR, TCALIVn, TRIM registers must be explicitly programmed with calibration values from OCOTP. Document optional phandle to OCOTP nvmem provider. Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Marek Vasut <marex@denx.de> Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
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Christian Marangi authored
The current tsens debugfs structure is composed by: - a tsens dir in debugfs with a version file - a directory for each tsens istance with sensors file to dump all the sensors value. This works on the assumption that we have the same version for each istance but this assumption seems fragile and with more than one tsens istance results in the version file not tracking each of them. A better approach is to just create a subdirectory for each tsens istance and put there version and sensors debugfs file. Using this new implementation results in less code since debugfs entry are created only on successful tsens probe. Signed-off-by: Christian Marangi <ansuelsmth@gmail.com> Link: https://lore.kernel.org/r/20221022125657.22530-4-ansuelsmth@gmail.comSigned-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
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Christian Marangi authored
For VER_0 the version was incorrectly reported as 0.1.0. Fix that and correctly report the major version for this old tsens revision. Signed-off-by: Christian Marangi <ansuelsmth@gmail.com> Link: https://lore.kernel.org/r/20221022125657.22530-3-ansuelsmth@gmail.comSigned-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
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Christian Marangi authored
Calibrate and tsens_register can fail or PROBE_DEFER. This will cause a double or a wrong init of the debugfs information. Init debugfs only with successful probe fixing warning about directory already present. Signed-off-by: Christian Marangi <ansuelsmth@gmail.com> Acked-by: Thara Gopinath <thara.gopinath@linaro.org> Link: https://lore.kernel.org/r/20221022125657.22530-2-ansuelsmth@gmail.comSigned-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
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Robert Marko authored
Qualcomm IPQ8074 uses tsens v2.3 IP, however unlike other tsens v2 IP it only has one IRQ, that is used for up/low as well as critical. It also does not support negative trip temperatures. Signed-off-by: Robert Marko <robimarko@gmail.com> Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Link: https://lore.kernel.org/r/20220818220245.338396-4-robimarko@gmail.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Robert Marko authored
IPQ8074 and IPQ6018 dont support negative trip temperatures and support up to 204 degrees C as the max trip temperature. So, instead of always setting the -40 as min and 120 degrees C as max allow it to be configured as part of the features. Signed-off-by: Robert Marko <robimarko@gmail.com> Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Link: https://lore.kernel.org/r/20220818220245.338396-3-robimarko@gmail.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Robert Marko authored
Despite using tsens v2.3 IP, IPQ8074 and IPQ6018 only have one IRQ for signaling both up/low and critical trips. Signed-off-by: Robert Marko <robimarko@gmail.com> Reviewed-by: Bjorn Andersson <andersson@kernel.org> Link: https://lore.kernel.org/r/20220818220245.338396-2-robimarko@gmail.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Robert Marko authored
Qualcomm IPQ8074 has tsens v2.3.0 block, though unlike existing v2 IP it only uses one IRQ, so tsens v2 compatible cannot be used as the fallback. We also have to make sure that correct interrupts are set according to compatibles, so populate interrupt information per compatibles. Signed-off-by: Robert Marko <robimarko@gmail.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20220818220245.338396-1-robimarko@gmail.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Ido Schimmel authored
The function does not free 'of_ops' upon failure, leading to a memory leak [1]. Fix by freeing 'of_ops' in the error path. [1] unreferenced object 0xffff8ee846198c80 (size 128): comm "swapper/0", pid 1, jiffies 4294699704 (age 70.076s) hex dump (first 32 bytes): 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 ................ d0 3f 6e 8c ff ff ff ff 00 00 00 00 00 00 00 00 .?n............. backtrace: [<00000000d136f562>] __kmalloc_node_track_caller+0x42/0x120 [<0000000063f31678>] kmemdup+0x1d/0x40 [<00000000e6d24096>] thermal_of_zone_register+0x49/0x520 [<000000005e78c755>] devm_thermal_of_zone_register+0x54/0x90 [<00000000ee6b209e>] pmbus_add_sensor+0x1b4/0x1d0 [<00000000896105e3>] pmbus_add_sensor_attrs_one+0x123/0x440 [<0000000049e990a6>] pmbus_add_sensor_attrs+0xfe/0x1d0 [<00000000466b5440>] pmbus_do_probe+0x66b/0x14e0 [<0000000084d42285>] i2c_device_probe+0x13b/0x2f0 [<0000000029e2ae74>] really_probe+0xce/0x2c0 [<00000000692df15c>] driver_probe_device+0x19/0xd0 [<00000000547d9cce>] __device_attach_driver+0x6f/0x100 [<0000000020abd24b>] bus_for_each_drv+0x76/0xc0 [<00000000665d9563>] __device_attach+0xfc/0x180 [<000000008ddd4d6a>] bus_probe_device+0x82/0xa0 [<000000009e61132b>] device_add+0x3fe/0x920 Fixes: 3fd6d6e2 ("thermal/of: Rework the thermal device tree initialization") Signed-off-by: Ido Schimmel <idosch@nvidia.com> Reviewed-by: Vadim Pasternak <vadimp@nvidia.com> Link: https://lore.kernel.org/r/20221020103658.802457-1-idosch@nvidia.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Keerthy authored
The debug print message to check the workaround applicability is inverted. Fix the same. Fixes: ffcb2fc8 ("thermal: k3_j72xx_bandgap: Add the bandgap driver support") Reported-by: Bryan Brattlof <bb@ti.com> Signed-off-by: Keerthy <j-keerthy@ti.com> Link: https://lore.kernel.org/r/20221010034126.3550-1-j-keerthy@ti.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Rob Herring authored
Convert the 'generic-adc-thermal' binding to DT schema format. The binding said '#thermal-sensor-cells' should be 1, but all in tree users are 0 and 1 doesn't make sense for a single channel. Drop the example's related providers and consumers of the 'generic-adc-thermal' node as the convention is to not have those in the examples. Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20221011175235.3191509-1-robh@kernel.orgSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Marcus Folkesson authored
Check against the upper temperature limit (125 degrees C) before consider the temperature valid. Fixes: 5eed800a ("thermal: imx8mm: Add support for i.MX8MM thermal monitoring unit") Signed-off-by: Marcus Folkesson <marcus.folkesson@gmail.com> Reviewed-by: Jacky Bai <ping.bai@nxp.com> Link: https://lore.kernel.org/r/20221014073507.1594844-1-marcus.folkesson@gmail.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Marcus Folkesson authored
GENMASK() is preferred to use for bitmasks. Signed-off-by: Marcus Folkesson <marcus.folkesson@gmail.com> Link: https://lore.kernel.org/r/20221014081620.1599511-1-marcus.folkesson@gmail.comSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Luca Weiss authored
Document the tsens-v2 compatible for sm8450 SoC. Signed-off-by: Luca Weiss <luca@z3ntu.xyz> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20221016090035.565350-5-luca@z3ntu.xyzSigned-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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- 02 Dec, 2022 1 commit
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Rafael J. Wysocki authored
- Add Raptor Lake-S support to the intel_tcc_cooling driver (Zhang Rui). - Make the intel_tcc_cooling driver detect TCC locking (Zhang Rui). - Address Coverity warning in intel_hfi_process_event() (Ricardo Neri). - Prevent accidental clearing of HFI in the package thermal interrupt status (Srinivas Pandruvada). - Protect the clearing of status bits in MSR_IA32_PACKAGE_THERM_STATUS and MSR_IA32_THERM_STATUS (Srinivas Pandruvada). - Allow the HFI interrupt handler to ACK an event for the same timestamp (Srinivas Pandruvada). * thermal-intel: thermal: intel: hfi: ACK HFI for the same timestamp thermal: intel: Protect clearing of thermal status bits thermal: intel: Prevent accidental clearing of HFI status thermal: intel: intel_tcc_cooling: Add TCC cooling support for RaptorLake-S thermal: intel: intel_tcc_cooling: Detect TCC lock bit thermal: intel: hfi: Improve the type of hfi_features::nr_table_pages
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- 25 Nov, 2022 1 commit
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Yang Yingliang authored
In some error paths before device_register(), the names allocated by dev_set_name() are not freed. Move dev_set_name() front to device_register(), so the name can be freed while calling put_device(). Fixes: 1dd7128b ("thermal/core: Fix null pointer dereference in thermal_release()") Signed-off-by: Yang Yingliang <yangyingliang@huawei.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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- 23 Nov, 2022 3 commits
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Srinivas Pandruvada authored
Some processors issue more than one HFI interrupt with the same timestamp. Each interrupt must be acknowledged to let the hardware issue new HFI interrupts. But this can't be done without some additional flow modification in the existing interrupt handling. For background, the HFI interrupt is a package level thermal interrupt delivered via a LVT. This LVT is common for both the CPU and package level interrupts. Hence, all CPUs receive the HFI interrupts. But only one CPU should process interrupt and others simply exit by issuing EOI to LAPIC. The current HFI interrupt processing flow: 1. Receive Thermal interrupt 2. Check if there is an active HFI status in MSR_IA32_THERM_STATUS 3. Try and get spinlock, one CPU will enter spinlock and others will simply return from here to issue EOI. (Let's assume CPU 4 is processing interrupt) 4. Check the stored time-stamp from the HFI memory time-stamp 5. if same 6. ignore interrupt, unlock and return 7. Copy the HFI message to local buffer 8. unlock spinlock 9. ACK HFI interrupt 10. Queue the message for processing in a work-queue It is tempting to simply acknowledge all the interrupts even if they have the same timestamp. This may cause some interrupts to not be processed. Let's say CPU5 is slightly late and reaches step 4 while CPU4 is between steps 8 and 9. Currently we simply ignore interrupts with the same timestamp. No issue here for CPU5. When CPU4 acknowledges the interrupt, the next HFI interrupt can be delivered. If we acknowledge interrupts with the same timestamp (at step 6), there is a race condition. Under the same scenario, CPU 5 will acknowledge the HFI interrupt. This lets hardware generate another HFI interrupt, before CPU 4 start executing step 9. Once CPU 4 complete step 9, it will acknowledge the newly arrived HFI interrupt, without actually processing it. Acknowledge the interrupt when holding the spinlock. This avoids contention of the interrupt acknowledgment. Updated flow: 1. Receive HFI Thermal interrupt 2. Check if there is an active HFI status in MSR_IA32_THERM_STATUS 3. Try and get spin-lock Let's assume CPU 4 is processing interrupt 4.1 Read MSR_IA32_PACKAGE_THERM_STATUS and check HFI status bit 4.2 If hfi status is 0 4.3 unlock spinlock 4.4 return 4.5 Check the stored time-stamp from the HFI memory time-stamp 5. if same 6.1 ACK HFI Interrupt, 6.2 unlock spinlock 6.3 return 7. Copy the HFI message to local buffer 8. ACK HFI interrupt 9. unlock spinlock 10. Queue the message for processing in a work-queue To avoid taking the lock unnecessarily, intel_hfi_process_event() checks the status of the HFI interrupt before taking the lock. If CPU5 is late, when it starts processing the interrupt there are two scenarios: a) CPU4 acknowledged the HFI interrupt before CPU5 read MSR_IA32_THERM_STATUS. CPU5 exits. b) CPU5 reads MSR_IA32_THERM_STATUS before CPU4 has acknowledged the interrupt. CPU5 will take the lock if CPU4 has released it. It then re-reads MSR_IA32_THERM_STATUS. If there is not a new interrupt, the HFI status bit is clear and CPU5 exits. If a new HFI interrupt was generated it will find that the status bit is set and it will continue to process the interrupt. In this case even if timestamp is not changed, the ACK can be issued as this is a new interrupt. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Reviewed-by: Ricardo Neri <ricardo.neri-calderon@linux.intel.com> Tested-by: Arshad, Adeel<adeel.arshad@intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Srinivas Pandruvada authored
The clearing of the package thermal status is done by Read-Modify-Write operation. This may result in clearing of some new status bits which are being or about to be processed. For example, while clearing of HFI status, after read of thermal status register, a new thermal status bit is set by the hardware. But during write back, the newly generated status bit will be set to 0 or cleared. So, it is not safe to do read-modify-write. Since thermal status Read-Write bits can be set to only 0 not 1, it is safe to set all other bits to 1 which are not getting cleared. Create a common interface for clearing package thermal status bits. Use this interface to replace existing code to clear thermal package status bits. It is safe to call from different CPUs without protection as there is no read-modify-write. Also wrmsrl results in just single instruction. For example while CPU 0 and CPU 3 are clearing bit 1 and 3 respectively. If CPU 3 wins the race, it will write 0x4000aa2, then CPU 1 will write 0x4000aa8. The bits which are not part of clear are set to 1. The default mask for bits, which can be written here is 0x4000aaa. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Reviewed-by: Ricardo Neri <ricardo.neri-calderon@linux.intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Srinivas Pandruvada authored
When there is a package thermal interrupt with PROCHOT log, it will be processed and cleared. It is possible that there is an active HFI event status, which is about to get processed or getting processed. While clearing PROCHOT log bit, it will also clear HFI status bit. This means that hardware is free to update HFI memory. When clearing a package thermal interrupt, some processors will generate a "general protection fault" when any of the read only bit is set to 1. The driver maintains a mask of all read-write bits which can be set. This mask doesn't include HFI status bit. This bit will also be cleared, as it will be assumed read-only bit. So, add HFI status bit 26 to the mask. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Reviewed-by: Ricardo Neri <ricardo.neri-calderon@linux.intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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- 14 Nov, 2022 9 commits
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Guenter Roeck authored
Thermal device operations may be called after thermal zone device removal. After thermal zone device removal, thermal zone device operations must no longer be called. To prevent such calls from happening, ensure that the thermal device is registered before executing any thermal device operations. Signed-off-by: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Guenter Roeck authored
Since no callers of thermal_zone_set_trips() are left, remove the function. Document __thermal_zone_set_trips() instead. Explicitly state that the thermal zone lock must be held when calling the function, and that the pointer to the thermal zone must be valid. Signed-off-by: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Guenter Roeck authored
Protect access to thermal operations against thermal zone removal by acquiring the thermal zone device mutex. After acquiring the mutex, check if the thermal zone device is registered and abort the operation if not. With this change, we can call __thermal_zone_device_update() instead of thermal_zone_device_update() from trip_point_temp_store() and from emul_temp_store(). Similar, we can call __thermal_zone_set_trips() instead of thermal_zone_set_trips() from trip_point_hyst_store(). Signed-off-by: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Guenter Roeck authored
In preparation to protecting access to thermal operations against thermal zone device removal, protect hwmon accesses to thermal zone operations with the thermal zone mutex. After acquiring the mutex, ensure that the thermal zone device is registered before proceeding. Signed-off-by: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Guenter Roeck authored
In thermal_zone_device_set_mode(), the thermal zone mutex is released only to be reacquired in the subsequent call to thermal_zone_device_update(). Introduce __thermal_zone_device_update(), which is similar to thermal_zone_device_update() but has to be called with the thermal device mutex held. Call the new function from thermal_zone_device_set_mode() to avoid the extra thermal device mutex release/acquire sequence in that function. With the new function in place, re-implement thermal_zone_device_update() as wrapper around __thermal_zone_device_update() to acquire and release the thermal device mutex. Signed-off-by: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Guenter Roeck authored
All callers of __thermal_zone_get_temp() already validated the thermal zone parameters. Move validation to thermal_zone_get_temp() where it is actually needed. Also add kernel documentation for __thermal_zone_get_temp(), listing the requirement that the function must be called with validated parameters and with thermal device mutex held. Signed-off-by: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Guenter Roeck authored
Calls to thermal_zone_get_temp() are not protected against thermal zone device removal. As result, it is possible that the thermal zone operations callbacks are no longer valid when thermal_zone_get_temp() is called. This may result in crashes such as BUG: unable to handle page fault for address: ffffffffc04ef420 #PF: supervisor read access in kernel mode #PF: error_code(0x0000) - not-present page PGD 5d60e067 P4D 5d60e067 PUD 5d610067 PMD 110197067 PTE 0 Oops: 0000 [#1] PREEMPT SMP NOPTI CPU: 1 PID: 3209 Comm: cat Tainted: G W 5.10.136-19389-g615abc6eb807 #1 02df41ac0b12f3a64f4b34245188d8875bb3bce1 Hardware name: Google Coral/Coral, BIOS Google_Coral.10068.92.0 11/27/2018 RIP: 0010:thermal_zone_get_temp+0x26/0x73 Code: 89 c3 eb d3 0f 1f 44 00 00 55 48 89 e5 41 57 41 56 53 48 85 ff 74 50 48 89 fb 48 81 ff 00 f0 ff ff 77 44 48 8b 83 98 03 00 00 <48> 83 78 10 00 74 36 49 89 f6 4c 8d bb d8 03 00 00 4c 89 ff e8 9f RSP: 0018:ffffb3758138fd38 EFLAGS: 00010287 RAX: ffffffffc04ef410 RBX: ffff98f14d7fb000 RCX: 0000000000000000 RDX: ffff98f17cf90000 RSI: ffffb3758138fd64 RDI: ffff98f14d7fb000 RBP: ffffb3758138fd50 R08: 0000000000001000 R09: ffff98f17cf90000 R10: 0000000000000000 R11: ffffffff8dacad28 R12: 0000000000001000 R13: ffff98f1793a7d80 R14: ffff98f143231708 R15: ffff98f14d7fb018 FS: 00007ec166097800(0000) GS:ffff98f1bbd00000(0000) knlGS:0000000000000000 CS: 0010 DS: 0000 ES: 0000 CR0: 0000000080050033 CR2: ffffffffc04ef420 CR3: 000000010ee9a000 CR4: 00000000003506e0 Call Trace: temp_show+0x31/0x68 dev_attr_show+0x1d/0x4f sysfs_kf_seq_show+0x92/0x107 seq_read_iter+0xf5/0x3f2 vfs_read+0x205/0x379 __x64_sys_read+0x7c/0xe2 do_syscall_64+0x43/0x55 entry_SYSCALL_64_after_hwframe+0x61/0xc6 if a thermal device is removed while accesses to its device attributes are ongoing. The problem is exposed by code in iwl_op_mode_mvm_start(), which registers a thermal zone device only to unregister it shortly afterwards if an unrelated failure is encountered while accessing the hardware. Check if the thermal zone device is registered after acquiring the thermal zone device mutex to ensure this does not happen. The code was tested by triggering the failure in iwl_op_mode_mvm_start() on purpose. Without this patch, the kernel crashes reliably. The crash is no longer observed after applying this and the preceding patches. Signed-off-by: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Guenter Roeck authored
Thermal device attributes may still be opened after unregistering the thermal zone and deleting the thermal device. Currently there is no protection against accessing thermal device operations after unregistering a thermal zone. To enable adding such protection, protect the device delete operation with the thermal zone device mutex. This requires splitting the call to device_unregister() into its components, device_del() and put_device(). Only the first call can be executed under mutex protection, since put_device() may result in releasing the thermal zone device memory. Signed-off-by: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Guenter Roeck authored
Accesses to thermal zones, and with it the thermal zone device mutex, are still possible after the thermal zone device has been unregistered. For example, thermal_zone_get_temp() can be called from temp_show() in thermal_sysfs.c if the sysfs attribute was opened before the thermal device was unregistered. Move the call to mutex_destroy from thermal_zone_device_unregister() to thermal_release() to ensure that it is only destroyed after it is guaranteed to be no longer accessed. Signed-off-by: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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- 09 Nov, 2022 2 commits
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Zhang Rui authored
Add RaptorLake to the list of processor models supported by the Intel TCC cooling driver. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Zhang Rui authored
When MSR_IA32_TEMPERATURE_TARGET is locked, TCC Offset can not be updated even if the PROGRAMMABE Bit is set. Yield the driver on platforms with MSR_IA32_TEMPERATURE_TARGET locked. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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- 28 Oct, 2022 2 commits
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Ricardo Neri authored
A Coverity static code scan raised a potential overflow_before_widen warning when hfi_features::nr_table_pages is used as an argument to memcpy in intel_hfi_process_event(). Even though the overflow can never happen (the maximum number of pages of the HFI table is 0x10 and 0x10 << PAGE_SHIFT = 0x10000), using size_t as the data type of hfi_features::nr_table_pages makes Coverity happy and matches the data type of the argument 'size' of memcpy(). Signed-off-by: Ricardo Neri <ricardo.neri-calderon@linux.intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Dan Carpenter authored
Return an error pointer if ->get_max_state() fails. The current code returns NULL which will cause an oops in the callers. Fixes: c408b3d1 ("thermal: Validate new state in cur_state_store()") Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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