- 14 Dec, 2022 36 commits
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https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linuxRafael J. Wysocki authored
Pull thermal driver changes for 6.2-rc1 from Daniel Lezcano: "- Add the sm8450 QCom compatible string in the DT bindings (Luca Weiss) - Use devm_platform_get_and_ioremap_resource on the ST platform to group two calls into a single one (Minghao Chi) - Add the sm8550 QCom compatible string in the DT bindings (Neil Armstrong) - Use GENMASK instead of bitmaps and validate the temperature after reading it (Marcus Folkesson) - Convert generic-adc-thermal to DT schema (Rob Herring) - Fix the debug print message where the logic is inverted (Keerthy) - Fix memory leak on thermal_of_zone_register() failure (Ido Schimmel) - Add support for IPQ8074 in the tsens driver along with the DT bindings (Robert Marko) - Fix and rework the debugfs code in the tsens driver (Christian Marangi) - Add calibration and DT documentation for the imx8mm driver (Marek Vasut) - Add DT bindings and compatible for the Mediatek SoCs mt7981 and mt7983 (Daniel Golle) - Don't show an error message if it happens at probe time while it will be deferred on the QCom SPMI ADC driver (Johan Hovold) - Add the HWMon support on the imx8mm board (Alexander Stein) - Remove a pointless include in the power allocator governor (Christophe JAILLET) - Add interrupt DT bindings for QCom SoCs SC8280XP, SM6350 and SM8450 (Krzysztof Kozlowski) - Fix inaccurate warning message for the QCom tsens gen2 (Luca Weiss) - Demote error log of thermal zone register to debug on the tsens QCom driver (Manivannan Sadhasivam) - Consolidate the TI Bandgap driver regarding how is handled the efuse values and the errata handling (Bryan Brattlof) - Document the Renesas RZ/Five as compatible with RZ/G2UL in the DT bindings (Lad Prabhakar) - Fix the irq handler return value in the LMh driver (Bjorn Andersson) - Delete platform remove callback as it is empty (Uwe Kleine-König)" * tag 'thermal-v6.2-rc1' of https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (34 commits) thermal/drivers/imx_sc_thermal: Drop empty platform remove function thermal/drivers/qcom/lmh: Fix irq handler return value dt-bindings: thermal: qcom-tsens: Add compatible for sm8550 thermal/drivers/st: Use devm_platform_get_and_ioremap_resource() dt-bindings: thermal: rzg2l-thermal: Document RZ/Five SoC dt-bindings: thermal: k3-j72xx: conditionally require efuse reg range dt-bindings: thermal: k3-j72xx: elaborate on binding description thermal/drivers/k3_j72xx_bandgap: Map fuse_base only for erratum workaround thermal/drivers/k3_j72xx_bandgap: Remove fuse_base from structure thermal/drivers/k3_j72xx_bandgap: Use bool for i2128 erratum flag thermal/drivers/k3_j72xx_bandgap: Simplify k3_thermal_get_temp() function thermal/drivers/qcom: Demote error log of thermal zone register to debug thermal/drivers/qcom/temp-alarm: Fix inaccurate warning for gen2 dt-bindings: thermal: qcom-tsens: narrow interrupts for SC8280XP, SM6350 and SM8450 thermal/core/power allocator: Remove a useless include thermal/drivers/imx8mm: Add hwmon support thermal: qcom-spmi-adc-tm5: suppress probe-deferral error message dt-bindings: thermal: mediatek: add compatible string for MT7986 and MT7981 SoC thermal: ti-soc-thermal: Drop comma after SoC match table sentinel thermal/drivers/imx: Add support for loading calibration data from OCOTP ...
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Uwe Kleine-König authored
A remove callback just returning 0 is equivalent to no remove callback at all. So drop the useless function. Signed-off-by:
Uwe Kleine-König <u.kleine-koenig@pengutronix.de> Link: https://lore.kernel.org/r/20221212220217.3777176-1-u.kleine-koenig@pengutronix.deSigned-off-by:
Daniel Lezcano <daniel.lezcano@kernel.org>
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Bjorn Andersson authored
After enough invocations the LMh irq is eventually reported as bad, because the handler doesn't return IRQ_HANDLED, fix this. Fixes: 53bca371 ("thermal/drivers/qcom: Add support for LMh driver") Reported-by:
Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by:
Bjorn Andersson <bjorn.andersson@linaro.org> Reviewed-by:
Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Link: https://lore.kernel.org/r/20220316180322.88132-1-bjorn.andersson@linaro.orgSigned-off-by:
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Neil Armstrong authored
The Qualcomm SM8550 platform has three instances of the tsens block, add a compatible for these instances. Signed-off-by:
Neil Armstrong <neil.armstrong@linaro.org> Reviewed-by:
Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Acked-by:
Amit Kucheria <amitk@kernel.org> Link: https://lore.kernel.org/r/20221114-narmstrong-sm8550-upstream-tsens-v1-0-0e169822830f@linaro.orgSigned-off-by:
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Minghao Chi authored
Convert platform_get_resource(), devm_ioremap_resource() to a single call to devm_platform_get_and_ioremap_resource(), as this is exactly what this function does. Signed-off-by:
Minghao Chi <chi.minghao@zte.com.cn> Signed-off-by:
ye xingchen <ye.xingchen@zte.com.cn> Link: https://lore.kernel.org/r/202211171409524332954@zte.com.cnSigned-off-by:
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Lad Prabhakar authored
The TSU block on the RZ/Five SoC is identical to one found on the RZ/G2UL SoC. "renesas,r9a07g043-tsu" compatible string will be used on the RZ/Five SoC so to make this clear, update the comment to include RZ/Five SoC. No driver changes are required as generic compatible string "renesas,rzg2l-tsu" will be used as a fallback on RZ/Five SoC. Signed-off-by:
Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com> Acked-by:
Rob Herring <robh@kernel.org> Reviewed-by:
Geert Uytterhoeven <geert+renesas@glider.be> Link: https://lore.kernel.org/r/20221115121629.1181667-1-prabhakar.mahadev-lad.rj@bp.renesas.comSigned-off-by:
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Bryan Brattlof authored
Only some of TI's J721E SoCs will need a eFuse register range mapped to determine if they're affected by TI's i2128 erratum. All other SoC will not need this eFuse range to function properly Update the bindings for the k3_j72xx_bandgap thermal driver so other devices will only need two register ranges Signed-off-by:
Bryan Brattlof <bb@ti.com> Reviewed-by:
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Bryan Brattlof authored
Elaborate on the function of this device node as well as some of the properties this node uses. Signed-off-by:
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Bryan Brattlof authored
Some of TI's J721E SoCs require a software trimming procedure for the temperature monitors to function properly. To determine if a particular J721E is not affected by this erratum, both bits in the WKUP_SPARE_FUSE0 region must be set. Other SoCs, not affected by this erratum, will not need this region. Map the 'fuse_base' region only when the erratum fix is needed. Signed-off-by:
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Bryan Brattlof authored
'fuse_base' is only needed during the initial probe function to provide data for a software trimming method for some of TI's devices affected by the i2128 erratum. The devices not affected will not use this region Remove fuse_base from the main k3_j72xx_bandgap structure Signed-off-by:
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Bryan Brattlof authored
Some of TI's J721E SoCs require a software trimming method to report temperatures accurately. Currently we are using a few different data types to indicate when we should apply the erratum. Change the 'workaround_needed' variable's data type to a bool to align with how we are using this variable currently. Signed-off-by:
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Bryan Brattlof authored
The k3_thermal_get_temp() function can be simplified to return only the result of k3_bgp_read_temp() without needing the 'ret' variable Signed-off-by:
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Manivannan Sadhasivam authored
devm_thermal_of_zone_register() can fail with -ENODEV if thermal zone for the channel is not represented in DT. This is perfectly fine since not all sensors needs to be used for thermal zones but only a few in real world. So demote the error log to debug to avoid spamming users. Signed-off-by:
Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org> Link: https://lore.kernel.org/r/20221029052933.32421-1-manivannan.sadhasivam@linaro.orgSigned-off-by:
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Luca Weiss authored
On gen2 chips the stage2 threshold is not 140 degC but 125 degC. Make the warning message clearer by using this variable and also by including the temperature that was checked for. Fixes: aa92b331 ("thermal/drivers/qcom-spmi-temp-alarm: Add support for GEN2 rev 1 PMIC peripherals") Signed-off-by:
Luca Weiss <luca.weiss@fairphone.com> Reviewed-by:
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Krzysztof Kozlowski authored
Narrow number of interrupts per variants: SC8280XP, SM6350 and SM8450. The compatibles are already used and described. They only missed the constraints of number of interrupts. Signed-off-by:
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Christophe JAILLET authored
This file does not use rcu, so there is no point in including <linux/rculist.h>. Remove it. Signed-off-by:
Christophe JAILLET <christophe.jaillet@wanadoo.fr> Reviewed-by:
Lukasz Luba <lukasz.luba@arm.com> Link: https://lore.kernel.org/r/9adeec47cb5a8193016272d5c8bf936235c1711d.1669459337.git.christophe.jaillet@wanadoo.frSigned-off-by:
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Alexander Stein authored
Expose thermal sensors as HWMON devices. Signed-off-by:
Alexander Stein <alexander.stein@ew.tq-group.com> Link: https://lore.kernel.org/r/20220726122331.323093-1-alexander.stein@ew.tq-group.comSigned-off-by:
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Johan Hovold authored
Drivers should not be logging errors on probe deferral. Switch to using dev_err_probe() to log failures when parsing the devicetree to avoid errors like: qcom-spmi-adc-tm5 c440000.spmi:pmic@0:adc-tm@3400: get dt data failed: -517 when a channel is not yet available. Signed-off-by:
Johan Hovold <johan+linaro@kernel.org> Reviewed-by:
Manivannan Sadhasivam <mani@kernel.org> Reviewed-by:
Andrew Halaney <ahalaney@redhat.com> Link: https://lore.kernel.org/r/20221102152630.696-1-johan+linaro@kernel.orgSigned-off-by:
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Daniel Golle authored
Document compatible string 'mediatek,mt7986-thermal' for V3 thermal unit found in MT7986 SoCs. 'mediatek,mt7981-thermal' is also added as it is identical with the thermal unit of MT7986. Signed-off-by:
Daniel Golle <daniel@makrotopia.org> Acked-by:
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Geert Uytterhoeven authored
It does not make sense to have a comma after a sentinel, as any new elements must be added before the sentinel. Signed-off-by:
Keerthy <j-keerthy@ti.com> Link: https://lore.kernel.org/r/1d6de2a80b919cb11199e56ac06ad21c273ebe57.1669045586.git.geert+renesas@glider.beSigned-off-by:
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Marek Vasut authored
The TMU TASR, TCALIVn, TRIM registers must be explicitly programmed with calibration values in OCOTP. Add support for reading the OCOTP calibration data and programming those into the TMU hardware. The MX8MM/MX8MN TMUv1 uses only one OCOTP cell, while MX8MP TMUv2 uses 4, the programming differs in each case. Based on U-Boot commits: 70487ff386c ("imx8mm: Load fuse for TMU TCALIV and TASR") ebb9aab318b ("imx: load calibration parameters from fuse for i.MX8MP") Reviewed-by:Peng Fan <peng.fan@nxp.com> Signed-off-by:
Marek Vasut <marex@denx.de> Signed-off-by:
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Marek Vasut authored
The TMU TASR, TCALIVn, TRIM registers must be explicitly programmed with calibration values from OCOTP. Document optional phandle to OCOTP nvmem provider. Acked-by:
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Christian Marangi authored
The current tsens debugfs structure is composed by: - a tsens dir in debugfs with a version file - a directory for each tsens istance with sensors file to dump all the sensors value. This works on the assumption that we have the same version for each istance but this assumption seems fragile and with more than one tsens istance results in the version file not tracking each of them. A better approach is to just create a subdirectory for each tsens istance and put there version and sensors debugfs file. Using this new implementation results in less code since debugfs entry are created only on successful tsens probe. Signed-off-by:
Christian Marangi <ansuelsmth@gmail.com> Link: https://lore.kernel.org/r/20221022125657.22530-4-ansuelsmth@gmail.comSigned-off-by:
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Christian Marangi authored
For VER_0 the version was incorrectly reported as 0.1.0. Fix that and correctly report the major version for this old tsens revision. Signed-off-by:
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Christian Marangi authored
Calibrate and tsens_register can fail or PROBE_DEFER. This will cause a double or a wrong init of the debugfs information. Init debugfs only with successful probe fixing warning about directory already present. Signed-off-by:
Thara Gopinath <thara.gopinath@linaro.org> Link: https://lore.kernel.org/r/20221022125657.22530-2-ansuelsmth@gmail.comSigned-off-by:
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Robert Marko authored
Qualcomm IPQ8074 uses tsens v2.3 IP, however unlike other tsens v2 IP it only has one IRQ, that is used for up/low as well as critical. It also does not support negative trip temperatures. Signed-off-by:
Robert Marko <robimarko@gmail.com> Reviewed-by:
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Robert Marko authored
IPQ8074 and IPQ6018 dont support negative trip temperatures and support up to 204 degrees C as the max trip temperature. So, instead of always setting the -40 as min and 120 degrees C as max allow it to be configured as part of the features. Signed-off-by:
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Robert Marko authored
Despite using tsens v2.3 IP, IPQ8074 and IPQ6018 only have one IRQ for signaling both up/low and critical trips. Signed-off-by:
Bjorn Andersson <andersson@kernel.org> Link: https://lore.kernel.org/r/20220818220245.338396-2-robimarko@gmail.comSigned-off-by:
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Robert Marko authored
Qualcomm IPQ8074 has tsens v2.3.0 block, though unlike existing v2 IP it only uses one IRQ, so tsens v2 compatible cannot be used as the fallback. We also have to make sure that correct interrupts are set according to compatibles, so populate interrupt information per compatibles. Signed-off-by:
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Ido Schimmel authored
The function does not free 'of_ops' upon failure, leading to a memory leak [1]. Fix by freeing 'of_ops' in the error path. [1] unreferenced object 0xffff8ee846198c80 (size 128): comm "swapper/0", pid 1, jiffies 4294699704 (age 70.076s) hex dump (first 32 bytes): 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 ................ d0 3f 6e 8c ff ff ff ff 00 00 00 00 00 00 00 00 .?n............. backtrace: [<00000000d136f562>] __kmalloc_node_track_caller+0x42/0x120 [<0000000063f31678>] kmemdup+0x1d/0x40 [<00000000e6d24096>] thermal_of_zone_register+0x49/0x520 [<000000005e78c755>] devm_thermal_of_zone_register+0x54/0x90 [<00000000ee6b209e>] pmbus_add_sensor+0x1b4/0x1d0 [<00000000896105e3>] pmbus_add_sensor_attrs_one+0x123/0x440 [<0000000049e990a6>] pmbus_add_sensor_attrs+0xfe/0x1d0 [<00000000466b5440>] pmbus_do_probe+0x66b/0x14e0 [<0000000084d42285>] i2c_device_probe+0x13b/0x2f0 [<0000000029e2ae74>] really_probe+0xce/0x2c0 [<00000000692df15c>] driver_probe_device+0x19/0xd0 [<00000000547d9cce>] __device_attach_driver+0x6f/0x100 [<0000000020abd24b>] bus_for_each_drv+0x76/0xc0 [<00000000665d9563>] __device_attach+0xfc/0x180 [<000000008ddd4d6a>] bus_probe_device+0x82/0xa0 [<000000009e61132b>] device_add+0x3fe/0x920 Fixes: 3fd6d6e2 ("thermal/of: Rework the thermal device tree initialization") Signed-off-by:Ido Schimmel <idosch@nvidia.com> Reviewed-by:
Vadim Pasternak <vadimp@nvidia.com> Link: https://lore.kernel.org/r/20221020103658.802457-1-idosch@nvidia.comSigned-off-by:
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Keerthy authored
The debug print message to check the workaround applicability is inverted. Fix the same. Fixes: ffcb2fc8 ("thermal: k3_j72xx_bandgap: Add the bandgap driver support") Reported-by:
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Rob Herring authored
Convert the 'generic-adc-thermal' binding to DT schema format. The binding said '#thermal-sensor-cells' should be 1, but all in tree users are 0 and 1 doesn't make sense for a single channel. Drop the example's related providers and consumers of the 'generic-adc-thermal' node as the convention is to not have those in the examples. Signed-off-by:
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Marcus Folkesson authored
Check against the upper temperature limit (125 degrees C) before consider the temperature valid. Fixes: 5eed800a ("thermal: imx8mm: Add support for i.MX8MM thermal monitoring unit") Signed-off-by:
Marcus Folkesson <marcus.folkesson@gmail.com> Reviewed-by:
Jacky Bai <ping.bai@nxp.com> Link: https://lore.kernel.org/r/20221014073507.1594844-1-marcus.folkesson@gmail.comSigned-off-by:
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Marcus Folkesson authored
GENMASK() is preferred to use for bitmasks. Signed-off-by:
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Luca Weiss authored
Document the tsens-v2 compatible for sm8450 SoC. Signed-off-by:
Luca Weiss <luca@z3ntu.xyz> Reviewed-by:
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Srinivas Pandruvada authored
When CPU doesn't support HFI (Hardware Feedback Interface), don't include BIT 26 in the mask to prevent clearing. otherwise this results in: unchecked MSR access error: WRMSR to 0x1b1 (tried to write 0x0000000004000aa8) at rIP: 0xffffffff8b8559fe (throttle_active_work+0xbe/0x1b0) Fixes: 6fe1e64b ("thermal: intel: Prevent accidental clearing of HFI status") Reported-by:Linus Torvalds <torvalds@linux-foundation.org> Tested-by:
Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by:
Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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- 12 Dec, 2022 1 commit
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Rafael J. Wysocki authored
Merge one more Intel thermal control change for 6.2-rc1: - Remove a pointless die_id chec from the Intel HFI thermal control driver (Ricardo Neri). * thermal-intel: thermal: intel: hfi: Remove a pointless die_id check
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- 02 Dec, 2022 2 commits
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Ricardo Neri authored
die_id is an u16 quantity. On single-die systems the default value of die_id is 0. No need to check for negative values. Plus, removing this check makes Coverity happy. Signed-off-by:
Ricardo Neri <ricardo.neri-calderon@linux.intel.com> Signed-off-by:
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Rafael J. Wysocki authored
- Add Raptor Lake-S support to the intel_tcc_cooling driver (Zhang Rui). - Make the intel_tcc_cooling driver detect TCC locking (Zhang Rui). - Address Coverity warning in intel_hfi_process_event() (Ricardo Neri). - Prevent accidental clearing of HFI in the package thermal interrupt status (Srinivas Pandruvada). - Protect the clearing of status bits in MSR_IA32_PACKAGE_THERM_STATUS and MSR_IA32_THERM_STATUS (Srinivas Pandruvada). - Allow the HFI interrupt handler to ACK an event for the same timestamp (Srinivas Pandruvada). * thermal-intel: thermal: intel: hfi: ACK HFI for the same timestamp thermal: intel: Protect clearing of thermal status bits thermal: intel: Prevent accidental clearing of HFI status thermal: intel: intel_tcc_cooling: Add TCC cooling support for RaptorLake-S thermal: intel: intel_tcc_cooling: Detect TCC lock bit thermal: intel: hfi: Improve the type of hfi_features::nr_table_pages
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- 25 Nov, 2022 1 commit
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Yang Yingliang authored
In some error paths before device_register(), the names allocated by dev_set_name() are not freed. Move dev_set_name() front to device_register(), so the name can be freed while calling put_device(). Fixes: 1dd7128b ("thermal/core: Fix null pointer dereference in thermal_release()") Signed-off-by:
Yang Yingliang <yangyingliang@huawei.com> Signed-off-by:
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